tag: TrendForce

DRAM Scaling Challenges Grow
By Mark LaPedus - 21 Nov, 2019 - Comments: 5

DRAM makers are pushing into the next phase of scaling, but they are facing several challenges as the memory technology approaches its physical limit. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. There are efforts in R&D to extend the technology, and ultimate... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Oct, 2019 - Comments: 0

Packaging and test In a major deal that has some implications in the OSAT supply chain, South Korea’s Nepes has taken over Deca Technologies’ wafer-level packaging manufacturing line in the Philippines. In addition, Nepes has also licensed Deca’s M-Series wafer-level packaging technology. This includes fan-in technology as well as wafer- and panel-level fan-out. It also includes an ad... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 06 Sep, 2019 - Comments: 0

China's DRAM efforts Two memory vendors from China, Tsinghua Unigroup and ChangXin Memory Technology, have disclosed more details about their respective efforts to enter the DRAM arena. As reported, Tsinghua Unigroup wants to enter the DRAM business. Now, the China-based firm has secured land to build a new DRAM fab. The firm recently signed an agreement with the Chongqing government to e... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 30 Aug, 2019 - Comments: 0

Chipmakers GlobalFoundries has filed suits in the U.S. and Germany, alleging that semiconductor manufacturing technologies used by TSMC infringe upon 16 of GF's patents. The suits were filed in the U.S. International Trade Commission (ITC), the U.S. Federal District Courts in the Districts of Delaware and the Western District of Texas, and the Regional Courts of Dusseldorf and Mannheim in Germ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 05 Jul, 2019 - Comments: 0

Fab tools and materials Applied Materials has signed a definitive agreement to acquire Kokusai Electric for $2.2 billion in cash from investment firm KKR. With the acquisition of Kokusai’s semiconductor equipment unit, Applied expands its customer base and gains a foothold in the batch processing equipment business, where a tool can process wafers in parallel. Applied’s strength is in the ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 14 Jun, 2019 - Comments: 0

Market research In the second quarter of 2019, TrendForce said that the top-5 foundry rankings remained identical with that of last year. But sixth to tenth place showed some changes. Who is up or down in what is a tough business climate? Global fab equipment spending will rebound in 2020, growing 20% to $58.4 billion after dropping 19% to $48.4 billion in 2019, according to SEMI. However, ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 24 May, 2019 - Comments: 0

Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Mar, 2019 - Comments: 0

Chipmakers TrendForce released its foundry rankings for the first quarter of 2019. TSMC is still the clear leader, followed in order by Samsung, GlobalFoundries and UMC, according to the firm. It was a tough quarter for all foundries. Samsung has rolled out its new High Bandwidth Memory (HBM2E) product. The new solution, called Flashbolt, is the industry’s first HBM2E to deliver a 3.2Gbps... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Jan, 2019 - Comments: 0

OEMs and chipmakers Apple has reduced its revenue outlook to $84 billion for the quarter, down from $89 billion to $93 billion in its original forecast. The consensus on Wall Street was $91 billion. “The guide down was mostly attributed to weaker-than-expected iPhone demand in emerging markets, predominantly China,” said John Vinh, an analyst with KeyBanc Capital Markets, in a research not... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 21 Nov, 2018 - Comments: 0

R&D Imec and CEA-Leti have signed a memorandum of understanding under which the two R&D organizations will form a strategic partnership in the domains of artificial intelligence and quantum computing. Europe hopes to accelerate its effort in both AI and quantum computing. Market research TrendForce announced the ranking of top 10 fabless IC design houses worldwide based on their revenues f... » read more

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