The Week In Review: Design

By Jesse Allen - 20 Jan, 2017 - Comments: 0

Legal Back in 2013, Synopsys filed suit against ATopTech for copyright infringement. The courts found in favor of Synopsys and ATopTech was damages were set at a little over $30M. With appeals unsuccessful, ATopTech announced that it has filed a voluntary petition under Chapter 11 of the Bankruptcy Code and has filed a motion to sell its businesses using a stalking horse bidder (an initial b... » read more

The Week In Review: Design

By Jesse Allen - 06 Jan, 2017 - Comments: 0

IP Arastu Systems uncorked a LPDDR3 DRAM Memory Controller. The controller is fully compliant with JEDEC standard JESD209-3C and supports various power down modes as well as multiple channels with a privilege to configure and manage each channel independently and parameterized data width. CSEM's Bluetooth Low Energy silicon RF IP has been validated as Bluetooth 5 compatible. RF test equip... » read more

Next Steps In Verification IP

By Ann Mutschler - 19 Feb, 2009 - Comments: 0

By Ann Steffora Mutschler With the cost of failure at an astronomical high, the last thing chip designers want to worry about is the physical IP they will use to build their SoC. In addition to less willingness on the customer’s behalf to take risks, complexity and economics have driven the need for more off-the-shelf IP and a corresponding rise in interest in verification IP. Compoundi... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Trilinear Technologies

The Week In Review: Design

The Week In Review: Design

Next Steps In Verification IP