tag: TSMC

Power Model Complexity Grows
By Ed Sperling - 13 Jan, 2011 - Comments: 0

By Ed Sperling The number of factors required for an effective power model has far surpassed the capabilities of even the most detailed spreadsheet at 45nm and beyond. It has now entered the realm of complex databases and architectural tradeoffs, and those tradeoffs will become even more complex as 3D stacking takes root over the next 24 months. The idea of modeling power is hardly new, but... » read more

Power Optimization Below 28nm
By Ed Sperling - 02 Dec, 2010 - Comments: 0

By Pallab Chatterjee Process scaling has normally been performed on a lithographic basis, but as processes dip below 32nm there are optimization options beyond the lithographic and area reduction. The Common Platform Group and GlobalFoundries have added the tradeoffs of power and performance optimization in addition to area in their 28nm flows. TSMC uses a five-way optimization that also h... » read more

The Future Of 3D Stacking
By Ed Sperling - 21 Oct, 2010 - Comments: 0

By Ed Sperling Despite concerns about the lack of tools, an unstable process, questionable interconnects, thermal overloads and electrostatic discharge, 3D stacking appears to be making headway. At the very least, lots of companies of all sizes are betting heavily that it will succeed. The first wave, which is expected to start showing up late next year, will likely come from a handful of t... » read more

Getting Ready For 15nm
By Ed Sperling - 07 Oct, 2010 - Comments: 0

By David Lammers The trends towards vertical transistors, non-silicon channel materials, and resistive RAMs promise to hold center stage at the 2010 IEEE International Electron Devices Meeting (IEDM), set to begin Dec. 6 in San Francisco, Calif. (www.ieee-iedm.org) Taiwan Semiconductor Manufacturing Co. (TSMC, Hsinchu, Taiwan) will present a 22/20nm technology platform based on a FinFET arc... » read more

The Shape Of Things To Come
By Ed Sperling - 26 Aug, 2010 - Comments: 0

By David Lammers Tall or thin? That is the question facing semiconductor companies, now reaching an “intense” phase in development of the vertical finFET and planar ETSOI (extra thin silicon on insulator) transistors for the 22/20nm and 15/14nm technology generations. “This is a conservative industry,” said Raj Jammy, vice president of materials and emerging technologies at Sematech... » read more

ESL Requires New Approaches To Design And Verification
By Ann Mutschler - 22 Jul, 2010 - Comments: 0

By Ann Steffora Mutschler As more data gets front loaded into SoC architectures today, understanding verification challenges as well as communication between the front and back end has never been more critical. “All of this is getting more complicated,” said John Ford, director of marketing at ARM. “There was a time when an ARM processor core was all that was on a chip. Now there’s ... » read more

EUV Focus Shifts To Affordability
By Ed Sperling - 08 Jul, 2010 - Comments: 0

By David Lammers Over the past year, key technologists in the semiconductor industry have come around to believing that EUV lithography will be available for critical mask layers in the next three to five years. What is still up for debate is whether EUV will be cost-effective for low-power consumer SoCs. To penetrate that cost-sensitive market, EUV must overcoming hurdles presented by masks, ... » read more

AMS Reference Flow 1.0: Ready For Prime Time?
By Ed Sperling - 24 Jun, 2010 - Comments: 0

By Pallab Chatterjee TSMC recently announced a game-changing flow for 32nm/28nm Analog Mixed Signal (AMS) design. The AMS flow 1.0 includes tools from multiple vendors that are sequenced to take a design from concept and device creation all the way to release to being included as IP in an SoC. The flow that is being offered is a departure from traditional custom analog and custom AMS design. ... » read more

Stressing Over 3D
By Ed Sperling - 24 Jun, 2010 - Comments: 0

By David Lammers Pol Marchal recalls putting a stacked 3D prototype on his desk at IMEC in Leuven, Belgium, last year, which a visitor picked up and examined two months later. “I don’t think this chip will work,” the visitor said, causing Marchal, principal scientist at IMEC’s 3D system integration program, to put the stacked die under a microscope. Sure enough, Pol found that mechanic... » read more

The Future Of IP
By Ed Sperling - 24 Jun, 2010 - Comments: 0

By Ed Sperling The rapid consolidation of the IP business is raising big questions about who will be left, whether new companies will join, and what it means for chipmakers looking to buy IP. In a period of one month Synopsys bought Virage Logic, which had just finished a buying spree of its own with the acquisitions of ARC and the IP business of NXP, and Cadence bought Denali. So what exac... » read more

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