Manufacturing Bits: Oct. 7

By Mark LaPedus - 07 Oct, 2014 - Comments: 0

Europe’s TFET project A new European project has revealed more details about its plans to develop a next-generation chip technology called tunnel field-effect transistors (TFETs). EPFL is coordinating this new European research project, dubbed E2SWITCH. The project also includes IBM, Forschungszentrum Jülich, the University of Lund, ETHZ, Imec, CCS, SCIPROM and IUNET. The project has be... » read more

Manufacturing Bits: June 17

By Mark LaPedus - 17 Jun, 2014 - Comments: 1

PiezoFET debuts The University of Twente MESA+ Research Institute and SolMateS have put a new twist on the finFET. A piezoelectric stressor layer has been deposited around the finFET, thereby enabling what researchers call the PiezoFET. The PiezoFET could enable steep sub-threshold slope devices. In the lab, this device was also able to reduce the leakage by a factor of five. [caption id... » read more

Manufacturing Bits: March 11

By Mark LaPedus - 11 Mar, 2014 - Comments: 0

Plasmonic lab-on-a-chip For some time, lab-on-a-chip (LOC) systems have generated interest in the medical field. LOC systems provide analysis of biomolecules for use in basic biology research, disease marker identification and pharmaceutical drug screening. In one effort, Boston University, the California Institute of Technology, EPFL, Pontificia Universidad Catolica del Peru and UCLA have ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Twente

Manufacturing Bits: Oct. 7

Manufacturing Bits: June 17

Manufacturing Bits: March 11