Week in Review: IoT, Security, Auto

By Jeff Dorsch - 28 Jun, 2019 - Comments: 0

Products/Services Visa agreed to acquire the token and electronic ticketing business of Rambus for $75 million in cash. The business involved is part of the Smart Card Software subsidiary of Rambus. It includes the former Bell ID mobile-payment businesses and the Ecebs smart-ticketing systems for transit providers. Meanwhile, Rambus expanded its CryptoManager Root of Trust product line. “Sec... » read more

Trump Wants Critical Metals

By Mark LaPedus - 15 Mar, 2018 - Comments: 0

In recent times, President Trump has taken an active role in the electronics and related sectors, notably the U.S. administration’s move to block Broadcom’s unsolicited, $117 billion takeover bid for Qualcomm. The Trump administration has also raised eyebrows by blocking other deals as well. And with little or no fanfare, the administration is also taking a role in another area—critica... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 23 Feb, 2018 - Comments: 0

Chipmakers Last year, Analog Devices Inc. (ADI) completed the acquisition of Linear Technology. Now, ADI plans to shut down one of Linear’s fabs as well as a test operation. “Analog Devices plans to close the smallest of its four wafer fabs, which was acquired as part of its March 2017 acquisition of Linear Technology and is located at Hillview Drive in Milpitas, California. This clo... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: U.S. Department of the Interior

Week in Review: IoT, Security, Auto

Trump Wants Critical Metals

The Week In Review: Manufacturing