Solving The Last-Mile Delivery Problem

By John Koon - 06 Jul, 2023 - Comments: 0

Retailers are deploying robots to cut costs and improve efficiency, opening new opportunities for chipmakers as well as a host of new challenges. Key to this strategy are autonomous roadside delivery robots (ARDRs). Retailers have been facing razor-thin profit margins for years and have turned their sights to increasing operational efficiency to stay competitive. Solving the last-mile delive... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 07 Jan, 2022 - Comments: 0

Automotive As part of its in-cabin monitoring wares at Consumer Electronics Show (CES) 2022, U.S.-based Gentex demonstrated the Vaporsens gas sensors, a nanofiber chemical sensor technology that monitors cabin air quality and can ID airborne contaminants. One use would be to monitor if outside contaminants get into the cabin, the sensor could trigger the car to turn on the recirculation of air... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 21 Sep, 2018 - Comments: 0

Internet of Things Release 3 is published by oneM2M, the worldwide Internet of Things interoperability standards initiative. The third set of specifications deals with 3GPP interworking, especially as it relates to cellular IoT connectivity, among other features. The release is said to enable seamless interworking with narrowband IoT and LTE-M connectivity through the 3GPP Service Capability E... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Udelv

Solving The Last-Mile Delivery Problem

Week In Review: Auto, Security, Pervasive Computing

Week in Review: IoT, Security, Auto