Startup Funding: November 2020

By Jesse Allen - 02 Dec, 2020 - Comments: 0

Numerous chipmakers pulled in funding in November 2020, with investors putting money into interconnects, memories, AI hardware, and quantum computing. Launching from stealth was a startup aiming to combine AI and 5G. Autonomous delivery did well, too, with one company raising a massive $500M. This month, we take a look at 28 companies that raised a collective $1.1B. Semi & design Connec... » read more

Startup Funding: January 2020

By Jesse Allen - 05 Feb, 2020 - Comments: 0

A dozen tech startup companies started 2020 with new funding, raising +$500 million between them. Three companies received an impressive amount of investment. Stanford spinout Skylo launched from stealth with $116M in total funding and a bold plan to connect IoT devices, particularly sensors in remote or difficult-to-access environments, with hubs that link them to a network of satellites. ... » read more

The Week in Review: IoT

By Jeff Dorsch - 22 Jun, 2018 - Comments: 0

Finance Marvell Technology Group priced $500 million in senior notes due in 2023 and $500 million in senior notes due in 2028. The chip company will use net proceeds from the debt offering, cash on hand, and borrowings under a new term loan facility to fund the cash consideration and other amounts payable for Marvell’s proposed $6 billion acquisition of Cavium. The companies have expected to... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Vito Ventures

Startup Funding: November 2020

Startup Funding: January 2020

The Week in Review: IoT