Chip Industry Week In Review


By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing Keysight Technologies introduced its new Electrical Performance Scan (EP-Scan), a high-speed digital simulation tool for rapid signal integrity (SI) analysis for hardware engineers and printed circuit board (PCB) designers. Siemens Digital Industries Software announced the opening of its eXplore Live at The Smart Factory @ Wichita, housed at Wichita State University’... » read more