Gallium-Based SMP for High-Performance Cu-to-Cu Bonding (National Cheng Kung Univ.)


A new technical paper titled "Sonochemical Synthesis of Submicrometer Ga-Based Particles for Cu-to-Cu Interconnection" was published by researchers at National Cheng Kung University. Abstract "Heterogeneous integration has been the most important electronic packaging technology, with the emerging needs of miniaturization of electronic devices. Conventional solders are gradually unable to me... » read more