Understanding Within-Wafer Variations: A Virtual Fabrication Approach


One of the unavoidable aspects of chip manufacturing is that some dies on a wafer perform differently than others, even though they were made together on the same wafer. This blog dives into that mystery and provides a way to predict and fix these issues. Imagine baking cookies. If your oven has hot and cold spots, some cookies will be perfect; others burnt. That’s what happens in chip man... » read more