Chip Industry Week In Review

By The SE Staff - 17 Jul, 2026 - Comments: 0

Advanced manufacturing, packaging Intel Foundry will invest €5B to expand Intel 3 capacity at its Leixlip, Ireland campus. The company also entered high-volume manufacturing for a subset of Panther Lake processors manufactured on its 18A using ASML’s High-NA EUV technology. UMC delivered the first production wafers for SILITH’s 1.6T silicon photonics platform from its 300mm Singa... » read more

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Startup Funding: Q1 2026

Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

by Jesse Allen

Advanced Packaging Limits Come Into Focus

Mechanical and process control limits are now shaping what can be manufactured at scale.

by Gregory Haley

All AI Data Center Interconnects Will Be Optical Within 5 Years

InP and SiPho join CMOS as critical technologies. Lasers, CPO and OCS will be everywhere (indium phosphide, silicon photonics, co-packaged optics, optical circuit switch).

by Geoff Tate

The Sub-2nm Paradox

Reducing variation in manufacturing, monitoring behavior over time, and targeting specific workloads can have a big impact on power, performance, and area/cost.

by Ed Sperling

When Semiconductor Materials Misbehave

The gap between lab performance and fab reality is growing wider as packages grow more complex.

by Gregory Haley

TSMC Tech Symposium 2026, By The Numbers

Foundry rolls out aggressive new roadmap, focusing on area, power, and latency.

by Barry Pangrle

Silicon Photonics Lights The Way To More Efficient Data Centers

Optical is the future, but getting there is harder than it looks.

by Katherine Derbyshire

Memory Wall Gets Higher

With SRAM failing to scale in recent process nodes, the industry must assess its impact on all forms of computing. There are no easy solutions on the horizon.

by Brian Bailey

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Chip Industry Week In Review

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