Week in Review: IoT, Security, Autos

By Jeff Dorsch - 23 Aug, 2019 - Comments: 0

Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

Week in Review: IoT, Security, Autos

By Jeff Dorsch - 26 Jul, 2019 - Comments: 0

Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 10 Aug, 2018 - Comments: 0

Cybersecurity Jens (Atom) Steube, a cybersecurity researcher and creator of the Hashcat password cracking tool, was probing for vulnerabilities in the new WPA3 security standard for Wi-Fi routers. WPA3 presents a robust defense against hacking, yet Steube discovered a security flaw in routers using WPA/WPA2 – one that leaves Wi-Fi passwords enabled with Pairwise Master Key Identifiers vulner... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Zigbee Alliance

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto