Week In Review: Auto, Security, Pervasive Computing

Edge, cloud, data center
Cadence added new verification IP (VIP) for hyperscalar data centers that supports CXL – Compute Express Link, HBM3, and Ethernet 802.3ck. The VIP are part of Cadence’s Verification Suite. Cadence also released IP for 56G long-reach SerDes on TSMC’s N7 and N6 process technologies.

Many Mentor, a Siemens Business, IC design tools are now certified TSMC’s N5 and N6 process technologies. Calibre nmPlatform extraction tool — including Calibre xACT — and the Analog FastSPICE (AFS) Platform support TSMC’s N5 and N6. AFS also supports TSMC’s mobile and high-performance computing (HPC).

AI, machine learning
Sony will embed Microsoft Azure AI on the Sony intelligent vision sensor IMX500, to extract more image data from a smart camera and give an option for having cloud-based AI inferencing from multiple cameras/devices. Sony is making a smart camera app that works with the sensor that includes Azure IoT and Cognitive Services to hook systems to the Cloud via Microsoft Azure if needed. Sony and Microsoft are targeting enterprises that, for instance, may want to gather inventory or shelf-stock intelligence and use AI to crunch the data into actionable intelligence. Independent software vendors (ISVs) specializing in computer vision and video analytics solutions, as well as smart camera original equipment manufacturers (OEMs) are the targets and both Sony and Microsoft will work with partners and enterprise customers in the areas of computer vision and video analytics as part of Microsoft’s AI & IoT Insider Labs program, according to a press release.

AI company SimpleMachines Inc. (SMI) will design UltraSoC’s embedded analytics into system-on-chip semiconductor products and its Composable Computing Platform. SMI is working on a processor architecture that is focuses on shrinking or optimizing the software rather than increasing the computing power of the hardware components. “UltraSoC’s embedded analytics will be designed into SMI’s allowing monitoring of internal bus transactions, processor execution and other system-wide behaviors within the device,” according to a press release.

Arteris’ IP FlexNoC Interconnect and AI package are being licensed by China-based leading AI SoC start-up Blue Ocean Smart System for AI chips.

Video: What is happening with eFPGAs? The eFPGAs promised programability and updating algorithms in AI. Flex Logix’s Geoff Tate updates the state of the eFPGA.

IoT, IIoT,
Cadence added new verification IP (VIP) for IoT, consumer/mobile that now supports TileLink, eUSB2, UFS 3.1, MIPI SPMIsm, MIPI RFFEsm v3.0. The VIP are part of Cadence’s Verification Suite.

Mil/aerospace
Austin, TX-based Coherent Logix, which designs embedded systems processors and EDA tools for creating embedded systems processors, is using SiFive’s RISC-V Core IP in its HyperX Platform to create mission-critical processors, SiFive revealed this week.

Xilinx announced its 20-nanometer space-grade FPGA with radiation tolerance across all orbits and ultra-high throughput and bandwidth for satellite and space applications. The 20nm Radiation Tolerant (RT) Kintex UltraScale XQRKU060 FPGA also has some machine learning, 1.6 TeraMACs of signal processing compute, and unlimited on-orbit reconfiguration.

Security
Sweden-based IAR Systems says NXP used its C-Trust security development tool to protecting certain NXP MCUs from unauthorized access, according to a press release. As of 2020, government regulation of IoT devices is increasingly requiring security protections. IAR Systems says the latest version of C-Trust adds support for NXP’s K22, K24, K64, KV56 and KV58 MCU devices building on existing K65/66 support.

Automotive/Mobility
Cadence added new verification IP (VIP) for automotive SoCs and microcontrollers. The VIP are part of Cadence’s Verification Suite.

Imagination Technologies’ IP conforms to ISO 26262 process after HORIBA MIRA audited of its Functional Safety Management System, according to a press release. ISO 26262 requires the whole engineering process in which automotive electronics are designed follows certain safety practices. HORIBA MIRA provides engineering, research, and test services to the automotive, defense, aerospace and rail sectors. Both Imagination Technologies and HORIBA MIRA serve on ISO26262 standards committees.

GM’s and LG Chem’s joint venture Ultium Cells is prepping ground for a new electric vehicle battery cell facility in Lordstown, OH. Separately Lordstown Motors, which took over a GM factory in Lordstown, is getting ready to produce electric SUVs and pickup trucks, some of which may start coming off the line in 2021. According to a quote in the Detroit Free Press, Lordstown Motors already has “well over a thousand” pre-orders for the $52,000 Endurance, even before the truck’s been revealed.”

The self-driving car company Voyage is working with FCA to adapt and validate the connections between the self-driving software, sensors, and embedded systems, according to a press release. Voyage put its self-driving technology into a purpose-built Chrysler Pacifica Hybrid, developed specifically by FCA for the integration of automated technology.

Video: Who owns a car’s chip architecture? Carmakers and their suppliers compete for dominance, creating challenges across the electronics industry. Arteris IP’s Kurt Shuler explains.

People & Companies
UltraSoC appointed Jonathan Lucas as vice president of software.

Intel is acquiring Rivet Networks, which produces Wi-FI high speed processing for gamers, to boost its Wi-Fi offerings. Rivet Networks will become part of Intel’s Wireless Solutions Group within the Client Computing Group.

Job, Event and Webinar Boards: Find industry jobs and upcoming conferences and webinars all in one place on Semiconductor Engineering. Knowledge Center: Boost your semiconductor industry knowledge. Videos: See the latest Semiconductor Engineering videos.