How To Deal With Electromigration

The replacement of aluminum with copper interconnect wiring, first demonstrated by IBM in 1997, brought the integrated circuit industry substantial improvements in both resistance to electromigration and line conductivity. Copper is both a better and more stable conductor than aluminum. Difficult though the transition was, it helped extend device scaling for another eighteen years (and counting... » read more

Extending Copper Interconnect Beyond The 14nm Node

Fabricating interconnects is one of the most process-intensive and cost-sensitive parts of manufacturing. To find out more about what's changing in this area and why it's so important, click here. » read more