New BEOL/MOL Breakthroughs?


Chipmakers are moving ahead with transistor scaling at advanced nodes, but it's becoming more difficult. The industry is struggling to maintain the same timeline for contacts and interconnects, which represent a larger portion of the cost and unwanted resistance in chips at the most advanced nodes. A leading-edge chip consists of three parts—the transistor, contacts and interconnects. The ... » read more

The Race To 10/7nm


Amid the ongoing ramp of 16/14nm processes in the market, the industry is now gearing up for the next nodes. In fact, GlobalFoundries, Intel, Samsung and TSMC are racing each other to ship 10nm and/or 7nm technologies. The current iterations of 10nm and 7nm technologies are scaled versions of today’s 16nm/14nm finFETs with traditional copper interconnects, high-k/metal-gate and low-k diele... » read more

What If EUV Fails?


It’s the worst kept secret in the industry, but extreme ultraviolet (EUV) lithography will likely miss the 10nm node. So, chipmakers will likely extend and use today’s 193nm immersion lithography down to 10nm. This, of course, will require a complex and expensive multiple patterning scheme. Now, chipmakers are formulating their lithography strategies for 7nm and beyond. As it stands now,... » read more