Tech Talk: System In Package


ASE fellow and senior technical advisor William Chen talks about advanced packaging options and why they are now so important. » read more

OSAT Biz: Growth And Challenges


Amid a challenging business environment, the outsourced semiconductor assembly and test (OSAT) industry is projected to see steady to strong growth in a number of packaging segments this year. Right now, the [getkc id="83" kc_name="OSATs"]—which provide third-party IC-packaging and test services—are seeing brisk demand for both legacy and advanced chip packages. In addition, IDMs continu... » read more

Tech Talk: Embedded Memories


Dave Eggleston, vice president of embedded memory at GlobalFoundries, talks about the pros and cons of new types of embedded memory, including which work best for certain applications and with various advanced packaging options. [youtube vid=7D9zoA9FFIw] » read more

From Uncertainty To New Markets


The 11th annual SEMI/Gartner Market Symposium at SEMICON West 2016 presented diverse perspectives on trends and developments in the macroeconomic environment as well as the semiconductor manufacturing supply chain. The themes have significant and immediate impact on the industry and include economic uncertainty, Brexit, China’s ambitious plans for an indigenous chip industry, and evolving end... » read more

How To Build Systems In Package


The semiconductor industry is racing to define a series of road maps for semiconductors to succeed the one created by the ITRS, which will no longer be updated, including a brand new one focused on heterogeneous integration. The latest entry will establish technology targets for integration of heterogeneous multi-die devices and systems. It has the support of IEEE's Components, Packaging and... » read more

Rethinking Memory


Getting data in and out of memory is as important as the speed and efficiency of a processor, but for years design teams managed to skirt the issue because it was quicker, easier and less expensive to boost processor clock frequencies with a brute-force approach. That worked well enough prior to 90nm, and adding more cores at lower clock speeds filled the gap starting at 65nm. After that, th... » read more

Why Packaging Matters


The semiconductor package is changing. What was until very recently considered an afterthought is now becoming a key part of the design process at all major chipmakers, and a critical factor in the extension of Moore's Law. This is a sharp reversal of what was almost universally an afterthought in planar silicon design and manufacturing. Rarely was the package an integral part of the archite... » read more

SEMICON Taiwan’s Packaging Punch


SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

Brite Semiconductor: Design Services


These days it's increasingly common for large commercial foundries to have a design services counterpart—TSMC has GlobalUnichip. GlobalFoundries has an entire ecosystem as well as a dedicated partner, Invecas. And China's SMIC has Brite Semiconductor. Brite was founded in 2008 by Open-Silicon as a way to tap the Chinese market, but the startup has taken some twists since then. It now is un... » read more

How To Test IoT Devices


At a recent event, test experts said the IC industry needs a new paradigm in testing chips for the [getkc id="76" comment="Internet of Things"] (IoT). The message was fairly simple to interpret. Existing automatic test equipment (ATE) is well suited to test today’s digital, analog, and mixed-signal chips, though it may be ill-equipped or too expensive to test IoT-based devices. But wha... » read more

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