Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Chip Industry’s Technical Paper Roundup: October 17


New technical papers added to Semiconductor Engineering’s library this week. [table id=155 /] More Reading Technical Paper Library home » read more

Patterning With EUV Lithography Without Photoresists


A technical paper titled “Resistless EUV lithography: photon-induced oxide patterning on silicon” was published by researchers at Paul Scherrer Institute, University College London, ETH Zürich, and EPFL. Abstract: "In this work, we show the feasibility of extreme ultraviolet (EUV) patterning on an HF-treated Si(100) surface in the absence of a photoresist. EUV lithography is the leading ... » read more

Research Bits: August 29


Resistive switching with hafnium oxide Researchers from the University of Cambridge, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo used hafnium oxide to build a resistive switching memory device that processes data in a similar way as the synapses in the human brain. At the atomic level, hafnium oxide has no structure, with the hafni... » read more

Chip Industry’s Technical Paper Roundup: July 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Resistive Switching Memory Based on Thin-Film Design of Amorphous Hafnium Oxide (Cambridge & Others)


A technical paper titled “Thin-film design of amorphous hafnium oxide nanocomposites enabling strong interfacial resistive switching uniformity” was published by researchers at University of Cambridge, Linköping University, Purdue University, University College London, Los Alamos National Laboratory, and University at Buffalo. Abstract: "A design concept of phase-separated amorphous nano... » read more

Chip Industry’s Technical Paper Roundup: Feb. 14


New technical papers recently added to Semiconductor Engineering’s library: [table id=80 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Transferring Qubits Directly Between Quantum Computing Microchips (U. of Sussex/ Universal Quantum)


A new technical paper titled "A high-fidelity quantum matter-link between ion-trap microchip modules" was published by researchers at University of Sussex, Universal Quantum Ltd, University College London and University of Bristol. “As quantum computers grow, we will eventually be constrained by the size of the microchip, which limits the number of quantum bits such a chip can accommodate.... » read more

Chip Industry’s Technical Paper Roundup: Oct 25


New technical papers added to Semiconductor Engineering’s library this week. [table id=59 /] » read more

Simulating the Groundstate and Dynamics of Quantum Critical Systems


A new technical paper titled "Simulating groundstate and dynamical quantum phase transitions on a superconducting quantum computer" was published by researchers at London Centre for Nanotechnology, University College London, University of Massachusetts, and Google Quantum AI. Abstract (partial) "The phenomena of quantum criticality underlie many novel collective phenomena found in condensed... » read more

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