HBM4 Memory: Break Through to Greater Bandwidth


Delivering unrivaled memory bandwidth in a compact, high-capacity footprint, has made HBM the memory of choice for AI training. HBM4 is the fourth major generation of the HBM standard, with new power management and RAS features. The Rambus HBM4 Controller provides industry-leading performance to 10.0 Gb/s, enabling a memory throughput of over 2.5 TB/s for training systems, generative AI and oth... » read more

The Feasibility Of Deploying FPGA-Based TCEP Synchronization In Real-World Quantum Networks


Precise time synchronization is a key challenge in building distributed quantum systems – and it plays a crucial role in secure communications, quantum computing, sensing, the foundations of future 6G networks and the quantum internet. In the paper titled "TCEP-Based Synchronization for Practical Communication Network,"researchers from TU Dresden, IIT Dharwad, Fraunhofer Institute for Inte... » read more

Verifying The Evolving UCIe Landscape


This paper details a verification strategy for UCIe 3.0 designs, integrating both legacy manageability architecture and emerging UCIe 3.0 features into a reusable, scalable framework. Built on a layered UVM architecture, Questa One Avery VIP for UCIe enables flexible modeling of complex domains through configurable APIs and supports automated discovery and routing table setup for both direct an... » read more

AI: Driving the Way to Safer and Smarter Cars


As autonomous vehicles have only begun to appear on limited public roads, it has become clear that achieving widespread adoption will take longer than early predictions suggested. With Level 3 systems in place, the road ahead leads to full autonomy and Level 5 self-driving. However, it’s going to be a long climb. Much of the technology that got the industry to Level 3 will not scale in all th... » read more

Blog Review: Sept. 10


Cadence's Satish Kumar C explains Port-Based Routing, a feature in in CXL 3.0 and 3.1 that changes how CXL switches operate within a CXL fabric to enable the creation of much larger, more flexible, and more efficient topologies. Siemens' Bill Hargin demystifies copper foil thickness and weight measurements and why being precise has an impact on signal integrity and crosstalk simulations.... » read more

A Lens Designer’s View Of Metaoptics: Aberration Theory For Flat Optics


By Dr. John R. Rogers and Dr. Yijin Ding. This paper covers a discussion of the Abbe Sine Condition and its implication for Flat Optics, including the effects of stop shift and substrate curvature. Following that, we apply Sweatt’s high index model of diffractive effects to develop a third-order aberration theory for diffractive, meta-, and hybrid optical systems, including the pos... » read more

Best Practices and HPC Strategies for Ansys Mechanical


Mechanical engineers face growing complexity in structural simulations. Modeling intricate geometries, capturing nonlinear material behaviors, and ensuring accurate boundary conditions often push traditional computing resources to their limits. These challenges can lead to longer solve times, convergence issues, and difficulties interpreting results — all of which slow innovation and impact p... » read more

3D-Stacked HBM Architecture Susceptibility To Thermal Attacks (NC A&T State, New Mexico State)


A new technical paper titled "On the Thermal Vulnerability of 3D-Stacked High-Bandwidth Memory Architectures" was published by researchers at North Carolina A&T State University and New Mexico State University. Abstract "3D-stacked High Bandwidth Memory (HBM) architectures provide high-performance memory interactions to address the well-known performance challenge, namely the memory wal... » read more

Optimizing LLM Training Under GPU Memory Constraints (Argonne, RIT)


A new technical paper titled "MLP-Offload: Multi-Level, Multi-Path Offloading for LLM Pre-training to Break the GPU Memory Wall" was published by researchers at Argonne National Laboratory and Rochester Institute of Technology. Abstract "Training LLMs larger than the aggregated memory of multiple GPUs is increasingly necessary due to the faster growth of LLM sizes compared to GPU memory. To... » read more

Interconnect Innovations In High Bandwidth Memory: Part 1


By Damon Tsai, Woo Young Han, and Tim Kryman The demand for high bandwidth memory (HBM) is accelerating across the semiconductor industry, driven by boundary-pushing artificial intelligence, high-performance computing, and advanced graphics. These technologies require access to vast datasets, which in turn increases the need for memory solutions that combine speed, density, and power efficie... » read more

← Older posts Newer posts →