Performance Boost In Powerful Real-Time Cortex-R Processor Using Data Prefetch Control
By Arm - 10 Apr, 2024 - Comments: 0

High-performance processors employ hardware data prefetching to reduce the negative performance impact of large main memory latencies. An effective prefetching mechanism can improve cache hit rate significantly. Data prefetching boosts the execution performance by fetching data before it is needed. While prefetching improves performance substantially on many programs, it can significantly red... » read more

Hybrid Methodology To Extract Kinetic And Magnetic Inductances For Superconductor Technologies
By Siemens EDA - 10 Apr, 2024 - Comments: 0

Integrated circuits (ICs) using superconductors have emerged as the technology of choice for artificial intelligence (AI), data centers, and cloud computing. However, innovative technology requires equally innovative physical verification solutions to ensure that these superconductor ICs deliver the performance and reliability they promise. We introduce an innovative hybrid methodology to extra... » read more

Low-Power Relaxation Oscillator With Temperature-Compensated Thyristor Decision Elements
By Fraunhofer IIS/EAS - 10 Apr, 2024 - Comments: 0

This paper presents a low-power 140 kHz relaxation oscillator (ROSC) for low-frequency clock generators and timers. In voltage-mode ROSCs, unavoidable shunt current consumption results from voltage slewing at the integration capacitor. The proposed circuit employs CMOS thyristor-based decision elements which effectively reduce shunt currents by exploiting internal positive feedback. A complemen... » read more

PCI Express Test Overview
By Keysight - 10 Apr, 2024 - Comments: 0

PCl Express, short for Peripheral Component Interconnect Express, is a high-performance and high-bandwidth serial communication interconnect standard. First proposed by Intel and further developed by the Peripheral Component Interconnect Special Interest Group (PCI-SIG) in replacement of bus-based communication architecture, such as PCI, PCI Extended (PCI-X), and Accelerated Graphics Port (AGP)... » read more

Quantum Well Design Basics
By Cadence - 10 Apr, 2024 - Comments: 0

Key Takeaways The choice of materials for the quantum well and barrier layers is paramount. Materials must have compatible lattice structures to minimize defects, with common combinations including GaAs/AlGaAs, InGaAs/InP, and GaN/AlGaN. The width of the quantum well significantly influences the energy levels and density of states, where narrower wells result in greater separation betwe... » read more

Amplify Simulation Via Effective Data And Process Management
By Ansys - 10 Apr, 2024 - Comments: 0

Over the past 50 years, engineering simulation has proven its value by reducing development time and costs, as well as dramatically improving product performance. By subjecting their designs to real-world physical forces in a risk-free virtual environment, product development teams can identify issues and address them at an early stage, thus minimizing expensive rework, prototyping, and physica... » read more

Blog Review: April 10
By Jesse Allen - 10 Apr, 2024 - Comments: 0

Cadence's Shyam Sharma looks at the evolution of the LPDDR standard and finds that LPDDR5X is opening new specialized markets for low-power DRAMs beyond the traditional areas of mobile, IoT, and automotive. Siemens' Hossam Sarhan and Dusan Petranovic find that new physical verification approaches are needed to ensure the performance and reliability of superconducting ICs and introduce a hybr... » read more

Chiplet Hardware Security Module To Mitigate Security Vulnerabilities In SiP Systems (Univ. of Florida)
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "Advancing Trustworthiness in System-in-Package: A Novel Root-of-Trust Hardware Security Module for Heterogeneous Integration" was published by researchers at University of Florida (Gainesville). Abstract: "The semiconductor industry has adopted heterogeneous integration (HI), incorporating modular intellectual property (IP) blocks (chiplets) into a unified syst... » read more

Comparison Of The Meta Modeling Approach With HGLs
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "The Argument for Meta-Modeling-Based Approaches to Hardware Generation Languages" was published by researchers at Infineon Technologies and TU Munich. Abstract "The rapid evolution of Integrated Circuit (IC) development necessitates innovative methodologies such as code generation to manage complexity and increase productivity. Using the right methodology for g... » read more

Using Palladium To Address Contact Issues Of Buried Oxide Thin Film Transistors
By Technical Paper Link - 09 Apr, 2024 - Comments: 0

A new technical paper titled "Approach to Low Contact Resistance Formation on Buried Interface in Oxide Thin-Film Transistors: Utilization of Palladium-Mediated Hydrogen Pathway" was published by researchers at Tokyo Institute of Technology and National Institute for Materials Science (NIMS). Abstract "Amorphous oxide semiconductors (AOSs) with low off-currents and processing temperatures... » read more

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