10 Things You Ought To Know Before You Benchmark Your Software Security Program
By Synopsys - 03 Feb, 2021 - Comments: 0

Benchmarking can help you get a new software security initiative off the ground or better navigate an existing one. It is different from other measurement techniques because it focuses on excellence, includes detailed comparisons, and pools confidential information among numerous organizations. To get you started in the right direction, we’ve put together some quick tips so you get the mos... » read more

Blog Review: Feb. 3
By Jesse Allen - 03 Feb, 2021 - Comments: 0

Cadence's Paul McLellan listens in on the outlook from SEMI's recent Industry Strategy Symposium, which looked at the prospects for global recovery, the application areas where growth is expected, and how segments have recently performed. Siemens EDA's Harry Foster takes a look at trends in the adoption of languages and libraries for IC and ASIC designs and finds continued interest in System... » read more

Hot Or Not? An Introduction To Electrical Thermal Co-Design
By Cadence - 03 Feb, 2021 - Comments: 0

Heat transfer is not a one-way street. Traditionally, thermal analysis and management is thought of as a mechanical problem. However, modern electronic products are highly susceptible to electronic thermal issues. The electronics are often both the cause of thermal issues and the victim of overheating if temperature profiles exceed specifications. Indeed, over 50% of IC failures are related ... » read more

Better Quality RTL
By Ann Mutschler - 02 Feb, 2021 - Comments: 0

How do you measure the quality of RTL? Philippe Luc, director of verification at Codasip, talks about identifying bugs, improving the overall quality of the verification, what happens when different blocks are used in a design, and how to improve efficiency in the verification process. » read more

Manufacturing Bits: Feb. 2
By Mark LaPedus - 02 Feb, 2021 - Comments: 0

Capacitor-less DRAM At the recent 2020 International Electron Devices Meeting (IEDM), Imec presented a paper on a novel capacitor-less DRAM cell architecture. DRAM is used for main memory in systems, and today’s most advanced devices are based on roughly 18nm to 15nm processes. The physical limit for DRAM is somewhere around 10nm. DRAM itself is based on a one-transistor, one-capacito... » read more

Power/Performance Bits: Feb. 2
By Jesse Allen - 02 Feb, 2021 - Comments: 0

MXene antennas Researchers at Drexel University and Villanova University developed spray-on antennas made of the 2D materials MXene that is flexible and light while maintaining good signal. "This combination of communications performance with extreme thinness, flexibility and durability sets a new standard for antenna technology," said Yury Gogotsi, professor of Materials Science and Engine... » read more

Automotive Functional Safety Compliance In EDA Tools And IP
By Swami Venkat - 01 Feb, 2021 - Comments: 1

By Swami Venkat and Meirav Nitzan A modern vehicle can boast as many as 100 million lines of code—that’s more than the Large Hadron Collider (50 million lines) and Facebook (62 million lines). On the hardware side, many of today’s cars have upwards of 100 electronic control units (ECUs) to run various functions. As automotive engineering ingenuity continues to drive further innovation ... » read more

Designing Low Energy Chips And Systems
By Ann Mutschler - 01 Feb, 2021 - Comments: 1

Energy optimization is beginning to shift left as design teams begin examining new ways to boost the performance of devices without impacting battery life or ratcheting up electricity costs. Unlike power optimization, where a skilled engineering team may reduce power by 1% to 5%, energy efficiency may be able to cut effective power in half. But those gains require a significant rethinking of... » read more

5G as a wireless power grid
By Technical Paper Link - 31 Jan, 2021 - Comments: 0

Abstract "5G has been designed for blazing fast and low-latency communications. To do so, mm-wave frequencies were adopted and allowed unprecedently high radiated power densities by the FCC. Unknowingly, the architects of 5G have, thereby, created a wireless power grid capable of powering devices at ranges far exceeding the capabilities of any existing technologies. However, this potential c... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 29 Jan, 2021 - Comments: 0

Packaging and test Intel has invested an additional $475 million in its chip assembly and test manufacturing facility in the Saigon Hi-Tech Park (SHTP) in Vietnam. This takes Intel’s total investment in the Vietnam facility to $1.5 billion. The site assembles and tests Intel’s 5G products and processors. TSMC recently announced a huge increase in capital spending for 2021. A large perce... » read more

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