From Data Center To End Device: AI/ML Inferencing With GDDR6
By Rambus - 09 Sep, 2020 - Comments: 0

Created to support 3D gaming on consoles and PCs, GDDR packs performance that makes it an ideal solution for AI/ML inferencing. As inferencing migrates from the heart of the data center to the network edge, and ultimately to a broad range of AI-powered IoT devices, GDDR memory’s combination of high bandwidth, low latency, power efficiency and suitability for high-volume applications will be i... » read more

Electro-Thermal Signoff For Next Gen 3DICs
By Ansys - 09 Sep, 2020 - Comments: 0

Multi-die designs, 2.5D and 3D, have been rising in popularity as they offer tremendously increased levels of integration, a smaller footprint, performance gains and more. While they are attractive for many applications, they also create design bottlenecks in the areas of thermal management and power delivery. For 3DICs, in addition to the complex SoC/PCB interactions seen in their 2D counterpa... » read more

A Summary Of Piezoelectric Energy Harvesting For Autonomous Smart Structures
By Fraunhofer IIS/EAS - 09 Sep, 2020 - Comments: 0

The technology of energy harvesting has great potential to enable energy autonomy of wireless sensors. The drop of power requirements of micro-electronic devices allows confidence that piezoelectric energy harvesting (PEH) is able to reliably power a wireless sensor network (WSN). The present work summarizes results of ongoing research in the field of PEH. With the aid of a performance metric a... » read more

Power/Performance Bits: Sept. 9
By Jesse Allen - 09 Sep, 2020 - Comments: 0

Smaller, cheaper integrated photonics Researchers from the University of California Santa Barbara, California Institute of Technology (Caltech), and Ecole Polytechnique Fédérale de Lausanne (EPFL) developed a way to integrate an optical frequency comb on a silicon photonic chip. Optical frequency combs are collections of equally spaced frequencies of laser light (so called because when pl... » read more

Are Chips Getting More Reliable?
By Ed Sperling - 08 Sep, 2020 - Comments: 0

The semiconductor industry is making huge progress in understanding the causes and telltale signs of circuit aging and irregular behavior. But are devices actually getting more reliable? The answer depends on a number of factors, none of which is easily measured. To be sure, circuits are much better designed and inspected than in the past, and the individual components are printed more accur... » read more

New Data Format Boosts Test Analytics
By Anne Meixner - 08 Sep, 2020 - Comments: 0

Demand for more and better data for test is driving a major standards effort, paving the way for one of most significant changes in data formats in years. There is good reason for this shift. Data from device testing is becoming a critical element in test program decisions regarding limits and flows. This is true for everything from automotive and medical components to complex, heterogeneous... » read more

Better Inspection, Higher Yield
By Bryon Moyer - 08 Sep, 2020 - Comments: 0

Wafers can be inspected for large, obvious defects, or for small, subtle ones. The former is referred to as macro-inspection, while the latter is micro-inspection. These processes use different machines with different capital and operating costs, and they might look like competing approaches with different economic returns. In fact, they are complementary tactics that can be balanced within an ... » read more

18 Things Fabless Start-Ups Should Look For In A Yield Management System
By yieldHUB - 08 Sep, 2020 - Comments: 0

Do you work for a fabless start-up? Are you ramping up? If so, you need data-analysis tools for your production data. You will struggle without them. You have two options for yield management analysis. You may decide to hire an engineer (or team of engineers) whose job it is to transfer the data from datalogs to a spreadsheet. Then generate reports. Or, you could invest in a system that takes c... » read more

Far Out AI In Remote Locations
By SE Staff - 08 Sep, 2020 - Comments: 0

There really isn’t anything that you can do on Earth with electronics that you can’t do in space, but it certainly can be a lot harder and take longer to fix is something goes wrong. And as more intelligent electronics are launched into space, the concern over potential failures is growing. AI inferencing has been pushing out further for some time, and it is starting to redefine what con... » read more

NanoResolution MRS Sensor: Fast, Precise 3D Inspection And Measurement for Advanced Semiconductor Packaging Applications
By CyberOptics - 08 Sep, 2020 - Comments: 0

The semiconductor packaging industry continues to advance, with new designs adding more layers, finer features and more I/O channels to achieve faster connections, higher bandwidth and lower power consumption. As packaging technologies have evolved, manufacturers have adapted old processes and adopted new processes to connect chips to each other and to the outside world. Often these new process... » read more

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