Power/Performance Bits: Nov. 25
By Jesse Allen - 25 Nov, 2019 - Comments: 0

Rigid or flexible in one device Researchers at the Korea Advanced Institute of Science and Technology (KAIST), Electronics and Telecommunications Research Institute (ETRI) in Daejeon, University of Colorado Boulder, Washington University in St. Louis, Cornell University, and Georgia Institute of Technology proposed a system that would allow electronics to transform from stiff devices to flexib... » read more

Using PCIe Real World Interface For High-Speed Hybrid Prototyping
By Synopsys - 25 Nov, 2019 - Comments: 0

This white paper highlights a novel approach to hybrid prototyping using a PCIe interface between the HAPS FPGA-based prototyping and the Virtualizer virtual prototyping. The use of PCIe real world interface helps to deliver a prototyping system, running fast enough to enable embedded software development and hardware-software co-validation in the shortest possible time. The hybrid prototyping ... » read more

Portable Stimulus And Digital Twins
By Brian Bailey - 25 Nov, 2019 - Comments: 0

It has been a year since Accellera's Portable Test and Stimulus Specification became a standard. Semiconductor Engineering sat down to discuss the impact it has had, and the future direction of it, with  Larry Melling, product management director for Cadence; Tom Fitzpatrick, strategic verification architect for Mentor, a Siemens Business; Tom Anderson, technical marketing consultant for OneSp... » read more

ISO 26262:2018 Fault Analysis In Safety Mechanisms
By OneSpin Solutions - 25 Nov, 2019 - Comments: 0

Authors: Jörg Grosse1, Mark Hampton1, Sergio Marchese1, Jörg Koch2, Neil Rattray1, Alin Zagardan2 1OneSpin Solutions, Munich, Germany 2Renesas Electronics Europe, Duesseldorf, Germany ISO 26262-5 requires the determination of hardware safety metrics, including SPFM and LFM. Latent and residual diagnostic coverage are also important metrics to assess the effectiveness of safety mechanisms... » read more

Electromagnetic Challenges In High-Speed Designs
By Ed Sperling - 25 Nov, 2019 - Comments: 0

ANSYS’ Anand Raman, senior director, and Nermin Selimovic, product sales specialist, talk with Semiconductor Engineering about how to deal with rising complexity and tighter tolerances in AI, 5G, high-speed SerDes and other chips developed at the latest process nodes where the emphasis is on high performance and low power. » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 22 Nov, 2019 - Comments: 0

Chipmakers For some time, Intel has experienced supply constraints and shortages for its 14nm chip products. Apparently, the company is still having issues with both 14nm and 10nm. “Despite our best efforts, we have not yet resolved this challenge,” according to a statement from Michelle Johnston Holthaus, executive vice president and general manager of the Sales, Marketing and Communicati... » read more

Week In Review: Design, Low Power
By Jesse Allen - 22 Nov, 2019 - Comments: 1

Accellera formed the Universal Verification Methodology Analog/Mixed-Signal Working Group (UVM-AMS WG), which will work to develop a standard that will provide a unified analog/mixed-signal verification methodology based on UVM to improve the verification of AMS integrated circuits and systems. “Our objective is to standardize a method to drive and monitor analog/mixed-signal nets within UVM,... » read more

Week In Review: IoT, Security, Automotive
By SE Staff - 22 Nov, 2019 - Comments: 0

Automotive Porsche’s electric race car, the 99X Electric, used ANSYS Technology’s system-level simulation solutions to create an advanced electric powertrain. The powertrain is also being adapted for use in Porsche’s consumer electric cars. "ANSYS system-level simulations are instrumental for optimizing the Porsche E-Performance Powertrain's motor, gearbox, power electronics and control ... » read more

Die-To-Die Connectivity
By Ed Sperling - 22 Nov, 2019 - Comments: 0

Manmeet Walia, senior product marketing manager at Synopsys, talks with Semiconductor Engineering about how die-to-die communication is changing as Moore’s Law slows down, new use cases such as high-performance computing, AI SoCs, optical modules, and where the tradeoffs are for different applications.   Interested in more Semiconductor Engineering videos? Sign-up for our YouTu... » read more

Is There A Crossover Point For Mainstream Anymore?
By Ed Sperling - 21 Nov, 2019 - Comments: 0

Until 28nm, it was generally assumed that process nodes would go mainstream one or two generations after they were introduced. So by the time the leading edge chips for smartphones and servers were being developed at 16/14nm and 10/7nm, it was assumed that developing a chip at 28nm would be less expensive, less complex, and that the process rule deck would shrink. That worked for decades. Th... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy