Compressing Datasets Created During Silicon Design
By Cadence - 23 Oct, 2019 - Comments: 0

Authors: Guru Rao, Distinguished Engineer; Shakir Abbas, Software Engineering Group Director; Mohammad Mirfendereski, Configuration Management Architect; Cadence. Harsh Sharangpani, CEO and CTO; Rajesh Patil, VP-Business Development; Ascava. During the design cycle for modern semiconductor components, a very large amount of data is generated and stored, often accumulating to hundreds of tera... » read more

Power Semi Wars Begin
By Mark LaPedus - 23 Oct, 2019 - Comments: 1

Several vendors are rolling out the next wave of power semiconductors based on gallium nitride (GaN) and silicon carbide (SiC), setting the stage for a showdown against traditional silicon-based devices in the market. Power semiconductors are specialized transistors that incorporate different and competitive technologies like GaN, SiC and silicon. Power semis operate as a switch in high-volt... » read more

Using SLX FPGA For Performance Optimization Of SHA-3 For HLS
By Silexica - 23 Oct, 2019 - Comments: 0

Author: Zubair Wadood SLX FPGA facilitates converting your C/C++ project into an FPGA bitstream easier and with higher performance. Leveraging standard HLS (High Level Synthesis) tools from FPGA vendors, SLX FPGA tackles the challenges associated with the HLS design flow. In this paper, the results of an SLX FPGA-optimized implementation of a Secure Hash Algorithm (SHA-3; also known as Kecca... » read more

Blog Review: Oct. 23
By Jesse Allen - 23 Oct, 2019 - Comments: 0

ANSYS' Magdy Abadir digs into the challenges associated with identifying and modeling electromagnetic crosstalk and the architectural and design trends that contribute to it. Cadence's Paul McLellan listens in as automotive security expert Charlie Miller points to how close we are to Level 4 autonomy and where in a car attack surfaces lie. Mentor's Brent Klingforth checks out the process ... » read more

Accelerating Toshiba’s Advanced System-on-Chip (SoC) Design with Synopsys’ Fusion Compiler
By Synopsys - 23 Oct, 2019 - Comments: 0

Authors: Mitchy M. Mitsuyasu, Senior Specialist, Semiconductor R&D, Toshiba Electronic Device & Storage Corp.; Akira Nikaido, Director Product Marketing, Synopsys. Toshiba Electronic Devices & Storage Corporation, part of the broader Toshiba, Kawasaki Japan, has long been a technology leader in Advanced SoCs spanning multiple, key market verticals. This includes automotive, communications, I... » read more

Scaling Formal Connectivity Checking To Multi-Billion-Gate SoCs With Specification Automation
By OneSpin Solutions - 23 Oct, 2019 - Comments: 0

Connectivity checking is a popular formal verification application. Formal tools can automatically generate assertions using a specification table as input and prove them exhaustively. Simulation-based verification, on the other hand, requires significantly more effort while providing a fraction of the coverage. However, chip complexity is rapidly increasing. ASICs and FPGAs for heterogeneous c... » read more

Thermal Challenges And Moore’s Law
By Ed Sperling - 22 Oct, 2019 - Comments: 0

Steven Woo, fellow and distinguished inventor at Rambus, looks at the evolution of graphics cards over a couple of decades and how designs changed to deal with more graphics and more heat, and why smaller, faster and cheaper doesn’t apply in this market. » read more

Manufacturing Bits: Oct. 22
By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

Power/Performance Bits: Oct. 22
By Jesse Allen - 22 Oct, 2019 - Comments: 0

Flexible battery Researchers at ETH Zurich developed a flexible thin-film battery that can be bent, stretched, and twisted without interrupting the supply of power. Key to the battery is a new electrolyte and entirely flexible components. "To date, no one has employed exclusively flexible components as systematically as we have in creating a lithium-ion battery," said Markus Niederberger, P... » read more

Rare Earth Battle Begins
By Mark LaPedus - 21 Oct, 2019 - Comments: 0

Rare earths are back in the news. The United States is increasing its efforts to develop and source rare earths elements (REE) to reduce its dependence on China in the arena. But this might be too little and too late for the U.S. Found in the Earth’s crust, rare earths are critical elements used in cars, consumer electronics, computers, communications, clean energy and defense systems.... » read more

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