category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

Process Model Calibration: Building Predictive And Accurate 3D Process Models
By Coventor - 16 Sep, 2020 - Comments: 0

The semiconductor industry has always faced challenges caused by device scaling, architecture evolution and process complexity and integration. These challenges are coupled with a need to provide new technology to the market quickly. In the initial stages of semiconductor technology development, innovative process flow schemes must be tested using silicon test wafers. These wafer tests are leng... » read more

Survey: 2019 eBeam Initiative Perceptions Survey Results
By eBeam Initiative - 16 Sep, 2020 - Comments: 0

Results of the 2020 eBeam Initiative Perceptions survey, now called the Luminaries survey, will be made available starting on September 22 here: Meanwhile, here is the 8th Annual Perceptions Survey – 2019 (July). 68 luminaries across 42 different companies participated. Some highlights: Deep learning impact predicted by 2020: 76% of the respondents say it’s somewhat to very lik... » read more

Challenges At 3/2nm
By Ed Sperling - 15 Sep, 2020 - Comments: 0

David Fried, vice president of computational products at Lam Research, talks about issues at upcoming process nodes, the move to EUV lithography and nanosheet transistors, and how process variation can affect yield and device performance. » read more

Manufacturing Bits: Sept. 15
By Mark LaPedus - 15 Sep, 2020 - Comments: 0

World’s largest camera The Department of Energy’s SLAC National Accelerator Laboratory has taken a step towards the development of the world’s largest digital camera. Target for astronomy applications, SLAC has developed a large 3,200-megapixel sensor array and has taken its first photos with the system. The sensor array will be integrated into the world’s largest digital camera, wh... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 11 Sep, 2020 - Comments: 0

Top story NVIDIA and SoftBank Group Corp. (SBG) have announced a definitive agreement under which NVIDIA will acquire Arm from SBG and the SoftBank Vision Fund in a transaction valued at $40 billion. Market research Here’s the latest fab equipment forecast from VLSI Research: “The semiconductor equipment market has been very resilient in 2020 despite a very challenging macroeconomic ... » read more

Manufacturing Bits: Sept. 9
By Mark LaPedus - 09 Sep, 2020 - Comments: 0

Fusion energy The U.S. Department of Energy (DOE) has announced $29 million in funding for several projects to develop fusion energy technology. The projects will focus on the components, materials and technologies to develop a long-awaited but elusive net-energy-gain “fusion core.” For years, companies, governments and universities have been working on fusion power technology. Fu... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 04 Sep, 2020 - Comments: 0

Market research What’s in store for the IC market in 2020 and 2021? Here’s the latest IC forecasts from IC Insights, Semico, Semiconductor Intelligence, WSTS and others. “We at Semiconductor Intelligence find it difficult to expect much of an increase in the world semiconductor market in 2020. However, the strength of the PC market and the relatively optimistic 3Q 2020 guidance of severa... » read more

Manufacturing Bits: Sept. 1
By Mark LaPedus - 01 Sep, 2020 - Comments: 0

AI, quantum computing R&D centers The White House Office of Science and Technology Policy, the National Science Foundation (NSF), and the U.S. Department of Energy (DOE) have announced over $1 billion in awards for the establishment of several new artificial intelligence and quantum information science (QIS) research institutes in the U.S. Under the plan, the U.S. is launching seven new... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Aug, 2020 - Comments: 0

Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

Understanding Advanced Packaging Technologies And Their Impact On The Next Generation Of Electronics
By Sandy Wen - 28 Aug, 2020 - Comments: 2

Chip packaging has expanded from its conventional definition of providing protection and I/O for a discrete chip to encompassing a growing number of schemes for interconnecting multiple types of chips. Advanced packaging has become integral to embedding increased functionality into a variety of electronics, such as cellular phones and self-driving vehicles, by supporting high device density in ... » read more

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