Week In Review: Manufacturing, Test


The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

Is It Time To Decentralize The Supply Chain?


One of the key requirements in any engineered system is a backup plan. A single point of failure in safety-critical or mission-critical applications can lead to disaster, whether that involves a smart phone, a car, a bridge, an airplane, or a design, manufacturing or business process. So why has this been largely ignored across the semiconductor manufacturing supply chain? The answer is comp... » read more

Auto Outlook: Down But Not Out


For years, automotive has been an engine of growth in the semiconductor industry, although the market is expected to decline in 2020. Several types of chips are used in automobiles, such as analog, memory, microcontrollers, processors and RF. But the automotive IC business still represents a small percentage of the overall semiconductor market. It pales in comparison to the smartphone chip m... » read more

Improving EUV Process Efficiency


The semiconductor industry is rethinking the manufacturing flow for extreme ultraviolet (EUV) lithography in an effort to improve the overall process and reduce waste in the fab. Vendors currently are developing new and potentially breakthrough fab materials and equipment. Those technologies are still in R&D and have yet to be proven. But if they work as planned, they could boost the flo... » read more

Scaling Up Compute-In-Memory Accelerators


Researchers are zeroing in on new architectures to boost performance by limiting the movement of data in a device, but this is proving to be much harder than it appears. The argument for memory-based computation is familiar by now. Many important computational workloads involve repetitive operations on large datasets. Moving data from memory to the processing unit and back — the so-called ... » read more

Fab Equipment Poised For A Record 2021


Global fab equipment spending promises to crawl out of a gloomy 2019 and see a modest recovery this year before a sharp uptick drives record investments in 2021 in a vivid display of the decades-old cyclicality playing out in the semiconductor industry. Typically – and reliably – fab investments fall into negative territory after two years of growth, though a few periods have bucked that... » read more

Big Problems In A Little Data World


Lam Executive Vice President and Chief Technology Officer, Richard A. Gottscho, gave a keynote at the SEMI Industry Strategy Symposium (ISS), the annual executive conference for the semiconductor industry. Titled “I’m Living in a Little Data World, but I Have a Big Problem,” Rick talked about the challenges faced by the “little data world” of process development and the potential for ... » read more

The Ins And Outs Of Silicon Carbide


John Palmour, CTO at Cree, sat down with Semiconductor Engineering to talk about silicon carbide, how it compares to silicon, what's different from a design and packaging standpoint, and where it's being used. What follows are excerpts of that conversation. SE: SiC is well-understood in power electronics and RF, but is the main advantage the ability to run devices hotter than silicon, or is ... » read more

Effective Post-TSV-DRIE Wet Clean Process For Through Silicon Via Applications


Deep Reactive Ion Etch (DRIE) processes used to form through silicon vias (TSVs) achieve high aspect ratios by depositing polymer on the vertical sidewalls of the features. This polymer material must be removed before other materials (including dielectric liner, Cu barrier, and Cu) are deposited in the TSVs. Clean processes adapted from Cu damascene integration flows use a combination of oxygen... » read more

Defect Evolution In Next Generation, Extreme Ultraviolet Lithography


Extreme ultraviolet (EUV) lithography is a promising next generation lithography technology that may succeed optical lithography at future technology nodes. EUV mask infrastructure and manufacturing of defect-free EUV mask blanks is a key near term challenge in the use of EUV lithography. Virtual fabrication is a computerized technique to perform predictive, three dimensional modeling of sem... » read more

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