category: Manufacturing, Packaging and Materials

category: Auto, Security & Edge AI

The End Of Copper Interconnects?
By Katherine Derbyshire - 21 Aug, 2025 - Comments: 0

After nearly three decades, the era of copper interconnects may be coming to an end. Sort of. At interconnect CDs below 10nm, copper is no longer the best metallization choice. Yet it remains unsurpassed for larger features. The most serious challenge to continued copper scaling is the metal’s dramatic increase in resistivity at dimensions below its relatively large (40nm) mean free path l... » read more

Transferable Hybrid Bonding Technique That Allows For High Integration Density In Advanced Packaging
By Brewer Science - 21 Aug, 2025 - Comments: 0

A technical paper titled "Hierarchical Multi-Layer and Stacking Vias with Novel Structure by Transferrable Cu/Polymer Hybrid Bonding for High Speed Digital Applications" was published by researchers at Industrial Technology Research Institute (ITRI) and Brewer Science. The paper demonstrates a "novel structure with hierarchical multi-layer stacking vias as well as transferred hybrid bonding,... » read more

AI, From A To Z
By Ed Sperling - 15 Aug, 2025 - Comments: 0

First in a seven-part series: What's the difference between AI, ML, DL, LLMs, and agentic AI? Is it truly revolutionary, or is it an evolutionary series of steps that have enabled machines to do much more than in the past? Jon Herlocker, vice president and general manager of software analytics at Cohu, talks about the evolution of AI over nearly 70 years, the chain of innovation that has enable... » read more

Advancing Outlier And Quality Control Methodologies
By yieldWerx - 04 Aug, 2025 - Comments: 0

Traditional outlier and quality control methodologies often assume that data will conform to ideal, Gaussian distributions. In practice, this is rarely the case. Upstream variability in manufacturing—ranging from process variation to equipment inconsistencies—can significantly impact the behavior of otherwise good die. Identifying subtle yield detractors requires examining a broader set of ... » read more

On-Die And In-Package Interconnects: eBook
By Bryon Moyer - 28 Jul, 2025 - Comments: 0

We live in the Information Age, but if information cannot get to where it's intended to go, it does no good. And the way information gets from here to there is through interconnects. This report focuses on different interconnect structures, such as lines, vias, buses, and networks-on-chip, and how they’re constructed. As always, we consider the design, test, reliability, and security impli... » read more

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces
By MinJae Kong - 24 Jul, 2025 - Comments: 0

In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is expected to continue, with expansion into areas such as central processing units (CPUs), artificial intelligence (AI) systems, and automotive products. Flip chip lidded ball grid array (FCLBGA) pa... » read more

GPU Acceleration Of Rigorous Lithography Simulations
By Wolfgang Demmerle - 24 Jul, 2025 - Comments: 0

Producing modern semiconductor devices is an immensely challenging process. Successful execution entails advanced process nodes, novel device architectures, new materials, and many fabrication steps. One especially challenging area is lithography, in which light is sent through a photomask, passes through a projection system of lenses and mirrors, and strikes the substrate to create the device ... » read more

AI, Product Lifecycle Management, Market Dynamics: Q&A With Jay Vleeschhouwer Of Griffin Securities 
By Bob Smith - 24 Jul, 2025 - Comments: 0

In the world of EDA, Jay Vleeschhouwer, managing director of software research at Griffin Securities, needs no introduction. His presentation on the State of EDA is standing room only at the yearly Design Automation Conference (DAC). He recently agreed to a discussion with me where we talked about AI and EDA, an interesting development with product lifecycle management and global dynamics af... » read more

The Race To Replace Silicon
By M. Rameez Arif - 24 Jul, 2025 - Comments: 1

For over 75 years, silicon has been the dominant material in the evolution of modern electronics, powering everything from smartphones to satellites. But as chipmakers push toward smaller nodes, higher power efficiency, and quantum-scale precision, a pressing question is echoing across fabs and R&D labs worldwide: Is it time to move beyond silicon? In this blog post, we explore the growi... » read more

Marginal Wafer Defects Can Slip Past Electrical Testing
By Errol Akomer - 24 Jul, 2025 - Comments: 0

Final electrical test remains one of the best ways to assess a circuit’s ultimate viability. But we know that, unfortunately, even 100% end-of-line electrical testing of semiconductor wafers will not guarantee that chips will not fail in the field. Certain non-killer but marginal wafer defects can still slip through electrical testing if they have sufficient electrical connectivity, even thou... » read more

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