The Week In Review: Manufacturing


Fab tool and material vendors Applied Materials reported its results for the third quarter ended July 31. Net sales of $2.82 billion were up 15% sequentially and up 13% year over year. "AMAT reported impressive upside in July quarter and guided October quarter well ahead of expectations as the company is seeing sizable tailwinds across: 1) WFE uptick driven by foundry and NAND orders; 2) stron... » read more

The Week In Review: Design


Tools Aldec uncorked its TySOM embedded development kit, which includes Riviera-PRO mixed-HDL language simulation for VHDL 2008/Verilog 2005, a Xilinx Zynq-based development board and pre-validated Ubuntu Embedded Host reference designs and tutorials. Mentor Graphics introduced the first phase of its new Xpedition PCB design flow with technologies for design and verification of rigid and ... » read more

Blog Review: Aug. 17


Mentor's Andrew Macleod listens in on the most pressing electrical engineering and embedded software challenges in the automotive industry today, in an IESF presentation by Paul Johnston. Many flash memory protocols have appeared, and Synopsys' Rahul Ramesh Chaudhari delves into ONFi in particular. Cadence's Paul McLellan digs into the challenges facing the development and roll out of 5G.... » read more

10nm Race Heats Up


The 10nm process and foundry race is heating up, as Intel announced its 10nm technology at its annual conference. As part of the multi-pronged announcement, Intel’s foundry unit forged a major partnership with ARM. Specifically, ARM will make its physical intellectual-property (IP) available on Intel’s 10nm process. Intel, in turn, will offer the IP for foundry customers. And on to... » read more

The Week In Review: IoT


Deals Rambus completed its $32 million acquisition of the Snowbush IP assets from Semtech. Through the end of 2022, Rambus may make additional payments on the transaction, depending upon new product sales. The Snowbush IP assets became part of the Memory and Interfaces Division at Rambus, complementing the company’s offerings in IP and serializer/deserializer blocks. Samsung Electronics A... » read more

The Week In Review: Manufacturing


Chipmakers At this week’s Flash Memory Summit, Samsung rolled out several new products, including its next-generation 3D NAND device and a solid-state drive (SSD) with capacities up to 32 terabytes. At the same time, Samsung introduced a new and high-performance SSD solution, dubbed the Z-SSD. Samsung’s Z-SSD shares the fundamental structure of V-NAND and has a unique circuit design and... » read more

The Week In Review: Design


IP Avery Design Systems released NVM Express over Fabrics 1.0 and NVM Express 1.2.1 extensions to its NVM-Xactor verification IP, enabling verification of both NVMe over PCIe and NVMe over Fabrics designs. Arastu Systems uncorked an optimized DDR3/4 DRAM Controller Core, which works with DFI 3.1 compatible PHY. The core supports all key DDR3/DDR4 features and additional features like Erro... » read more

Blog Review: Aug. 10


Is the end near for FinFETs? Applied's Mike Chudzik digs into the impact of rising parasitic resistance and parasitic capacitance and the challenges of scaling to 5nm. Cadence's Paul McLellan checks out the method UC Berkeley is using to build RISC-V processors. Mentor's Colin Walls warns that in C even the simplest things, like the declaration of variables, have pitfalls for the unwary. ... » read more

Preparing For 5G


If you like 4G LTE, you’re going to love 5G. The next-generation wireless communications technology will offer faster data transmission speeds and lower latency, providing the processing power to drive augmented-reality and virtual-reality applications for mobile devices and dedicated headsets. There is a caveat, though. The world needs to develop a consensus on what the 5G spectrum wil... » read more

The Week in Review: IoT


Deals Rambus finalized its acquisition of the memory interconnect business at Inphi. The closing price was $90 million in cash. The former Inphi business became part of the Memory and Interfaces Division at Rambus. CyberX raised $9 million of private funding in a financing round led by Flint Capital. Glilot Capital Partners, Swarth Group, and GlenRock, all existing investors, were joined by... » read more

← Older posts Newer posts →