System Bits: July 22


All graphene is not the same Widely touted as the most electrically conductive material ever studied, researchers at the University of Pennsylvania now understand that all graphene is not the same. With so few atoms comprising the entirety of the material, the arrangement of each one has an impact on its overall function. The team has used an advanced microscope to study the relationship be... » read more

Power/Performance Bits: July 22


Lasers to replace quartz in electronics? While nearly all electronics today require devices called oscillators that create precise frequencies, future high-end navigation systems, radar systems, and even possibly tomorrow's consumer electronics will require references beyond the performance of quartz, according to researchers at Caltech. In fact, these researchers have developed a method to... » read more

Manufacturing Bits: July 22


Skateboarding on 2D materials Two-dimensional materials are gaining steam in the R&D labs. The 2D materials include graphene, boron nitride (BN) and the transition-metal dichalcogenides (TMDs). These materials are attractive candidates for futuristic field-effect transistors (FETs). But researchers must gain more insight into these materials in order to understand their properties. For ... » read more

The Week In Review: Manufacturing


IBM’s move to sell its chip business to GlobalFoundries may have stalled or is dead, according to the Albany Times Union and other news outlets. New York Governor Andrew Cuomo announced that the state will partner with over 100 private companies, led by GE, to launch the New York Power Electronics Manufacturing Consortium. GE will be a lead partner in a fab, housed at the CNSE Nano Tech co... » read more

The Week In Review: Design


Tools Cadence unveiled two new tools. The first is a rapid prototyping platform that the company claims will shorten bring-up time by 70%, with 4X improvements in capacity, with IEEE 1801 support for low-power verification through its emulation platform. The second is a single and multi-corner custom/analog extraction tool, which it claims will improve performance by 5X. The tool has been cert... » read more

Blog Review: July 16


Mentor’s Scott Salzwedel describes a conversation that could very well happen in the future and it raises an interesting idea. As medical electronics proliferate, will emergency medical teams need to include out systems engineers? Cadence’s Brian Fuller has a summer engineering project that resembles the Bridge Over the River Kwai. He should win an Oscar for this one. Ansys’ Bill ... » read more

EDA Tools, IP Sales Up


EDA sales grew 4.6% in the first quarter, down slightly year-over-year as sales in Japan dragged down the rest of the market. Sales in Japan dropped 19% year over year as the country’s electronics industry struggles for footing against rivals in China and South Korea. North America and Europe grew 7% and 7.5% respectively, according to statistics provided by the EDA Consortium. Within thos... » read more

Power/Performance Bits: July 15


Improving battery performance with sand Researchers at the University of California, Riverside’s Bourns College of Engineering have created a lithium ion battery that outperforms the current industry standard by three times using sand as the key material. The researchers, who said this is a low cost, non-toxic, environmentally-friendly way to produce high performance lithium ion battery a... » read more

Manufacturing Bits: July 15


Multi-beam hits milestone Mapper Lithography has reached a major milestone in its ongoing push to bring multi-beam, direct-write lithography into the mainstream. The Dutch-based company recently installed its initial pre-production tool at CEA-Leti, a French-based R&D organization. The tool, dubbed Matrix 1.1, is a multi-beam, e-beam system for direct-write applications. During the r... » read more

System Bits: July 15


Silicon oxide memories Thanks to a refinement that will allow manufacturers to fabricate devices at room temperature with conventional production methods, Rice University’s silicon oxide technology for high-density, next-generation computer memory is one step closer to mass production. Rice’s silicon oxide memories are a type of two-terminal, “resistive random-access memory” (RRAM) ... » read more

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