The Week In Review: Design


M&A Cadence completed its acquisition of Jasper Design Automation, using cash and revolving credit to finance the deal. It will explain the impact on 2014 financial results in fiscal 2015. Jasper’s team, led by CEO Kathryn Kranen, will now report to Cadence senior VP Charlie Huang in Cadence’s System & Verification Group. The deal was first announced in April. Tools Coverity un... » read more

The Week In Review: Manufacturing


According to one analyst, the capital spending picture looks gloomy. “We expect finFET and 3D NAND to ramp over the next two years. However, foundry and memory customers are showing great restraint with respect to spending plans, limiting the rate of new node transitions and overall capex upside. In the near term, we see no evidence of meaningful equipment orders to support high-volume finFET... » read more

Blog Review: June 18


Mentor’s Vern Wnek recalls “a living hell” of being trapped in a small office for three weeks with a PCB designer who ate too much garlic and sweated profusely. This could be a reality TV series. What do engineers really think about UVM? Cadence's Richard Goering braved a 7 a.m. breakfast at DAC to hear a panel of experts, including reps from Intel, Ericsson, Imagination and Freescale,... » read more

Manufacturing Bits: June 17


PiezoFET debuts The University of Twente MESA+ Research Institute and SolMateS have put a new twist on the finFET. A piezoelectric stressor layer has been deposited around the finFET, thereby enabling what researchers call the PiezoFET. The PiezoFET could enable steep sub-threshold slope devices. In the lab, this device was also able to reduce the leakage by a factor of five. [caption id... » read more

Power/Performance Bits: June 17


Nanotubes boost terahertz detectors Researchers at Rice University, Sandia National Laboratories and the Tokyo Institute of Technology have developed novel terahertz detectors based on carbon nanotubes that could improve medical imaging, airport passenger screening, food inspection and other applications. Unlike current terahertz detectors, the devices are flexible, sensitive to polarizatio... » read more

System Bits: June 17


Smartphone for good: Adapted to reduce falls Purdue University researchers have shown how to modify a smartphone so that it can be used to measure a person's walking gait to prevent falls in people with compromised balance, such as the elderly or those with Parkinson's disease. The technology is being commercialized as SmartGait, and was designed as a tool to aid health care officials in as... » read more

The Week In Review: Design


Tools Mentor Graphics uncorked a tool for IC, package and board optimization, assembly and visualization. Of particular note is a “virtual die model” capability, which can be used across multiple domains in the design process. Deals Rambus inked a patent licensing agreement with Qualcomm Global Trading, a subsidiary of Qualcomm, for memory, interface and security technologies. The secu... » read more

The Week In Review: Manufacturing


In a much-anticipated deal, IBM is close to selling its chip unit to GlobalFoundries, according to Bloomberg. GlobalFoundries wants IBM’s engineers and the IP, and not the fabs. Intel lost its challenge against a record 1.06 billion euro ($1.44 billion) European Union fine handed down five years ago, according to Reuters. The EU said Intel tried to thwart AMD by giving rebates to PC makers... » read more

Blog Review: June 11


eSilicon’s Jack Harding says that EDA and semiconductors need to focus heavily on recruiting the next generation of brilliant engineers. This technology is cool, and even better it makes all the other cool technology work. It’s time to remind the rest of the world. Cadence’s Brian Fuller distills a panel discussion at DAC on computer vision—the sensors that enable driverless cars, a... » read more

Power/Performance Bits: June 10


Cheaper, lighter solar cells Think those flat, glassy solar panels on your neighbor’s roof are the best solar technology has to offer? Not so. Engineers in the University of Toronto’s Department of Electrical & Computer Engineering have designed and tested a new class of solar-sensitive nanoparticle that they say outperforms the current state of the art. Based on a new form of solid... » read more

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