category: News

category: Auto, Security & Edge AI

Accellera Updates UVM Standard
By Ed Sperling - 01 Jul, 2014 - Comments: 2

Accellera uncorked its backward-compatible UVM 1.2 standard, which fixes dozens of bugs, including sequences for run-time phasing and support for multithreading. “We’ve solved more than a dozen incompatibilities and improved overall productivity,” said Intel’s Thomas Alsop, who serves as co-chair of the UVM (Universal Verification Methodology) working group. “This is a major releas... » read more

System Bits: July 1
By Ann Mutschler - 01 Jul, 2014 - Comments: 0

In the quest to build gadgets that can survive the abuse, engineers have been testing electronic systems based on new materials that are both flexible and switchable – that is, capable of toggling between two electrical states: on-off, one-zero, the binary commands that can program all things digital. At the same time, three Stanford researchers believe that they’ve discovered just such ... » read more

Power/Performance Bits: July 1
By Ann Mutschler - 01 Jul, 2014 - Comments: 0

Cheap, rechargeable, organic Intended for use in power plants and intend to make the energy grid more resilient and efficient, USC researchers have developed a water-based organic battery that is long lasting and built from cheap, eco-friendly components. The new battery, which uses no metals or toxic materials, is intended for use in power plants, where it can make the energy grid more resili... » read more

Manufacturing Bits: July 1
By Mark LaPedus - 01 Jul, 2014 - Comments: 0

Nanotubes in 4D The California Institute of Technology (Caltech) has continued to advance its efforts in four-dimensional electron microscopy. In 4D microscopy, electrons bombard a sample. Each electron scatters off the sample. This produces an image at just a femtosecond in duration. Then, millions of the images are stitched together, which, in turn, produces a digital movie in 4D. [cap... » read more

The Week In Review: Design
By Ed Sperling - 27 Jun, 2014 - Comments: 0

Tools eSilicon uncorked a GDSII online quote system for TSMC, which allows chipmakers to pick a variety of information ranging from process technology to package to yield and tapeout and production forecast and get a quote within minutes. This is a new twist in the value chain provider market. Synopsys added program to speed up FPGA-based prototype creation, which includes approved third-pa... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 27 Jun, 2014 - Comments: 0

As semiconductor technology becomes more challenging, expect more mergers and acquisitions in the fab tool sector. In a research report issued this week, Weston Twigg, an analyst with Pacific Crest Securities, sees several possible M&A scenarios in the future. There is no evidence that any deal is pending right now. But according to Twigg, here are some possible M&As that could happen i... » read more

Blog Review: June 25
By Ed Sperling - 25 Jun, 2014 - Comments: 0

Is the Amazon Fire smart phone a paradigm shift? Cadence’s Brian Fuller looks at the first application-specific smart phone and why it’s noteworthy—regardless of how well it fares against phones made by Apple and Samsung. Rambus’ Deepak Chandra Sekar digs deep into interconnect technology and where the prevailing winds are blowing—copper barrier/cap/liner optimization, a slowdown i... » read more

System Bits: June 24
By Ann Mutschler - 24 Jun, 2014 - Comments: 0

Experimental 36-core chip The more cores — or processing units — a computer chip has, the bigger the problem of communication between cores becomes. For years, Li-Shiuan Peh, the Singapore Research Professor of Electrical Engineering and Computer Science at MIT, has argued that the massively multicore chips of the future will need to resemble little Internets, where each core has an associ... » read more

Power/Performance Bits: June 24
By Ann Mutschler - 24 Jun, 2014 - Comments: 0

Solar-cell efficiency in one step Rice University scientists have created a single-step process for producing highly efficient materials that let the maximum amount of sunlight reach a solar cell. The Rice lab of chemist Andrew Barron found a simple way to etch nanoscale spikes into silicon that allows more than 99 percent of sunlight to reach the cells’ active elements, where it can be t... » read more

Manufacturing Bits: June 24
By Mark LaPedus - 24 Jun, 2014 - Comments: 0

A cup of sub-wavelength images The National Institute of Standards and Technology (NIST) and the University of Michigan have developed a technology that could enable sub-wavelength images at radio frequencies. Researchers used a mere glass cup, and laser light at optical wavelengths, to measure and image RF fields. In the future, this technology could measure the behavior of metamaterials. ... » read more

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