category: News

category: Auto, Security & Edge AI

System Bits: May 13
By Ann Mutschler - 13 May, 2014 - Comments: 0

Bringing hyperbolic metamaterials closer to reality Purdue Researchers have taken a step toward practical applications for hyperbolic metamaterials, which are ultra-thin crystalline films that could bring optical advances for microscopes, quantum computers and high-performance solar cells. Optical metamaterials harness clouds of electrons called surface plasmons to manipulate and control li... » read more

The Week In Review: Design
By Ed Sperling - 09 May, 2014 - Comments: 0

Tools Ansys-Apache rolled out a new version of its power noise and reliability tool for finFET-based designs. Given the fact that dynamic power is going to be a massive headache at 14/16nm and beyond due to much greater density, this is a first step in dealing with it. This is just the beginning of a massive effort by EDA to retool for finFETs and the 2.5D/3D architectures. Synopsys rolled... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 May, 2014 - Comments: 0

Samsung Electronics announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips, dubbed 3D V-NAND. A recent chemical leak at Intel’s fab in Arizona was contained and two workers were taken to a hospital for observation, according to reports. Apparently, Intel was i... » read more

Blog Review: May 7
By Ed Sperling - 07 May, 2014 - Comments: 0

What if your toothbrush could talk? Semico Research’s Michell Prunty looks at the crowd-funded connected toothbrush design. And what else can it do? Cadence’s Richard Goering attended the Electronic Design Process Symposium in Monterey and summed up the progress in ESL: Power is less of an issue (for the moment), emulation is cheaper, but there is still a dearth of expertise and standard... » read more

Power/Performance Bits: May 6
By Ann Mutschler - 06 May, 2014 - Comments: 0

Boosting image quality UCLA researchers have created a device based on a new material and manufacturing process that they say could lead to a significant leap in the quality of images on smartphones, computer displays, TVs and inkjet printers. The new material and manufacturing process are used to produce semiconductors that are essential to LCDs and organic light-emitting diode (OLED) disp... » read more

System Bits: May 6
By Ann Mutschler - 06 May, 2014 - Comments: 0

Nonlinear optical resonance The drive to develop ultrasmall and ultrafast electronic devices using a single atomic layer of semiconductors, such as transition metal dichalcogenides, has received a significant boost. Researchers with Berkeley Lab have recorded the first observations of a strong nonlinear optical resonance along the edges of a single layer of molybdenum disulfide. The existence ... » read more

Manufacturing Bits: May 6
By Mark LaPedus - 06 May, 2014 - Comments: 0

Litho beam startup A startup has developed a new beam technology for advanced lithography applications. The company, called Digibeam, has demonstrated the ability to shoot a particle beam through a slow wave RF structure to create a train of compressed beam packets for high-throughput lithography. “Synchronized with high-speed deflection, the core technology enables shot rates well into t... » read more

The Week In Review: Design
By Ed Sperling - 02 May, 2014 - Comments: 0

Tools CEVA integrated Bluetooth processing into its DSP cores. In addition to audio and video and always-on capabilities, the company is pitching the combination as an all-in-one, ultra-low-power solution for the wearable electronics market. So how big is this market opportunity? IDC predicts the wearable computing market will grow from 19.2 million units this year to 112 million units in 2... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 02 May, 2014 - Comments: 0

Intel has submitted a business plan to upgrade its fab in Israel, according to reports. Crocus Nano Electronics (CNE), the joint venture founded in 2011 by Crocus Technology and Russia’s RUSNANO, has raised $60 million from its investors. The venture is Russia’s first 300mm fab. This first production line was completed one year after construction began. Currently, 200mm and 300mm CMOS wa... » read more

Blog Review: April 30
By Ed Sperling - 30 Apr, 2014 - Comments: 0

Applied Materials’ Jeremy Read points to a looming problem for the Internet of Things—legacy fabs that will require software upgrades and advanced process control. Also needed: Sensors attached to thousands of machines for predictive maintenance. Foundries are now ready for production finFETs. Cadence's Richard Goering captures the buzz at last week’s TSMC Tech Symposium, where the ro... » read more

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