Blog Review: May 21


Mentor’s Colin Walls offers up some new insights into C++ exception handling, thanks to some input from colleague Jonathan Roelofs. This one involves minimizing overhead and reducing runtime penalties. Synopsys’ Mick Posner is back in the saddle again—literally. This is about as green as it gets. Cadence’s Arthur Marris reports back on the IEEE 802.3 Ethernet standards meeting, in... » read more

System Bits: May 20


Re-routing noise away from measurement Today, we are capable of measuring the position of an object with unprecedented accuracy, but quantum physics and the Heisenberg uncertainty principle place fundamental limits on our ability to measure. Noise that arises as a result of the quantum nature of the fields used to make those measurements imposes what is called the "standard quantum limit," whi... » read more

Manufacturing Bits: May 20


Brain chips Pennsylvania State University has developed a technology that could enable futuristic biochips, namely those that mimic the human brain. In the lab, Penn State combined a thin film of vanadium dioxide (VO2) on a titanium dioxide substrate to create an oscillating switch. VO2 is an exotic material that exhibits semiconductor-to-metal transitions at 68 °C. In the R&D stage fo... » read more

Power/Performance Bits: May 20


Visualizing complex electronic states While producing the first detailed visualization — down to the level of individual atoms — of exactly how a material called sodium manganese dioxide that has shown promise for use in electrodes in rechargeable batteries behaves during charging and discharging, a team of researchers led by MIT has explained an exotic molecular state that may help in und... » read more

The Week In Review: Manufacturing


IC Insights has released its rankings of the Q1 ‘14 top 25 semiconductor suppliers. Outside of the top five spots, there were numerous changes. MediaTek jumped up four positions. Also, last year’s Micron/Elpida merger created a new giant semiconductor company with Micron’s sales expected to be over $17 billion this year. Toshiba will demolish the No. 2 semiconductor fabrication facilit... » read more

The Week In Review: Design


M&A Synopsys’ Coverity subsidiary bought Kalistick, a French company that makes cloud-based solutions to boost testing efficiency by allowing engineers to identify and prioritize tests. Terms of the deal were not disclosed. Tools Cadence rolled out verification IP for the new PCI Express 4.0 architecture. The new spec supports up to 16 billion transactions per second, which is double... » read more

Blog Review: May 14


Ansys’ Bill Vandermark highlights the top five engineering articles of the week. Of particular note is element No. 117, a new entry in the periodic table. The temporary name is ununseptium, which means…well, surprise…117. Cadence’s Brian Fuller follows a panel discussion about the biggest potential roadblock for the IoT’s success—privacy and security. You’ve been warned. Syn... » read more

Cobalt To The Rescue


A big concern for chipmakers is a key part of the manufacturing flow—the backend-of-the-line (BEOL). In chip production, the BEOL is where the interconnects are formed within a device. Interconnects, those tiny wiring schemes in devices, are becoming more compact at each node. This, in turn, is causing a degradation in performance and an increase in the dreaded resistance-capacitance (RC) ... » read more

Power/Performance Bits: May 13


More electricity out of solar cells When sunlight shines on today’s solar cells, much of the incoming energy is given off as waste heat rather than electrical current but in a few materials, extra energy produces extra electrons. According to researchers at MIT, this behavior could significantly increase solar-cell efficiency. The team has identified the mechanism by which the phenomenon ... » read more

Manufacturing Bits: May 13


Telling a FIB The National Institute of Standards and Technology (NIST) has built the first low-energy focused ion beam (FIB) microscope that uses a lithium ion source. Still in the R&D stage, the FIB microscope from NIST could be used to examine adjacent materials that are chemically different and identify the elements that make them up. The FIB microscope uses an ion source based on p... » read more

← Older posts Newer posts →