category: News

category: Auto, Security & Edge AI

Blog Review: Feb. 19
By Ed Sperling - 19 Feb, 2014 - Comments: 0

Adding a GUI to an RTOS? It may sound counterintuitive, but Mentor’s Colin Walls looks at why and where they’re being used. Cadence’s Richard Goering infuses some humor into signal integrity, which could definitely use it, courtesy of Eric Bogatin and Henny Youngman. When was the last time you saw a signal integrity engineer rolling on the floor in hysterical laughter? Well, there’s ... » read more

Power/Performance Bits: Feb. 18
By Ann Mutschler - 18 Feb, 2014 - Comments: 1

Outperforming copper Carbon nanotube-based fibers invented at Rice University have greater capacity to carry electrical current than copper cables of the same mass -- on a pound-per-pound basis -- according to new research. While individual nanotubes are capable of transmitting nearly 1,000 times more current than copper, the same tubes coalesced into a fiber using other technologies fail l... » read more

Manufacturing Bits: Feb. 18
By Mark LaPedus - 18 Feb, 2014 - Comments: 1

Polite cupcake helping robots Cornell and Carnegie Mellon have made a new discovery about robots. If they sound less snippy when they communicate, listeners will respond better. In fact, developers of robots should develop systems that use less confrontational language. In the study, entitled “How a Robot Should Give Advice,” researchers discovered that robots and humans are more lik... » read more

System Bits: Feb. 18
By Ann Mutschler - 18 Feb, 2014 - Comments: 0

Is my iPad making me sick? If you’ve ever felt sick or queasy after using a mobile device for an extended period of time, researchers from the University of Minnesota, believe they know why. In a recent study, participants played video games on iPads - under controlled, experimental conditions - and experienced motion sickness almost a third of the time. The risk of motion sickness was fo... » read more

The Week In Review: System-Level Design
By Ed Sperling - 14 Feb, 2014 - Comments: 0

Cadence bought TranSwitch’s high-speed interface IP assets. TranSwitch, which made chips for communications equipment, filed for bankruptcy in November. (The company’s Web site is no longer active.) Cadence also won a deal with Microsoft, which will use Tensilica processors in the new Xbox One audio subsystem. And Cadence rolled out HiFi Audio Tunneling for Android, which takes advantage of... » read more

Week In Review: Manufacturing, Design, Test
By Mark LaPedus - 14 Feb, 2014 - Comments: 0

Prosecutors have charged the CEO of chipmaker Entropic Communications with assaulting a model who appeared on the reality television show "Beverly Hills Nannies," according to the L.A. Times. Molecular Imprints Inc. (MII) has signed an agreement to sell its semiconductor imprint lithography equipment business to Canon. The agreement also allows for the creation of a new company that will ke... » read more

Blog Review: Feb. 12
By Ed Sperling - 12 Feb, 2014 - Comments: 0

Mentor’s Colin Walls adds his perspective to a recent survey by Jim Turley, asking which part of the embedded system development process engineers would rather not change. The choices were the chip, the OS and the tools. Any guesses as to the winner? Cadence’s Richard Goering conducts an interview based on a new branch of circular logic—the CERN supercollider where the Higgs Boson was... » read more

Power/Performance Bits: Feb. 11
By Ann Mutschler - 11 Feb, 2014 - Comments: 0

Low-power chip for cochlear implants without external hardware Existing versions of cochlear implants require that a disk-shaped transmitter about an inch in diameter be affixed to the skull, with a wire snaking down to a joint microphone and power source that looks like an oversized hearing aid around the patient’s ear...until now. Researchers at MIT’s Microsystems Technology Laboratory a... » read more

Manufacturing Bits: Feb. 11
By Mark LaPedus - 11 Feb, 2014 - Comments: 1

Monolithic 3D SRAM project A group of companies have started a research project to propel the development of monolithic 3D chip technology. The research project, called COMPOSE³, involves the ability to stack transistors vertically. Within three years, the group hopes to unveil a proof of concept for building the world’s first 14nm, 3D-stacked SRAM cell based on III-V materials. Co... » read more

System Bits: Feb. 11
By Ann Mutschler - 11 Feb, 2014 - Comments: 0

Ballistic transport in graphene Using electrons more like photons could provide the foundation for a new type of electronic device that would capitalize on the ability of graphene to carry electrons with almost no resistance even at room temperature in a process known as ballistic transport, according to researchers at Georgia Tech. Ballistic transport is the process by which electrical res... » read more

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