Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Fraunhofer IIS has opened a five-kilometer (3.11-mile) 5G test bed for automotive 5G applications near the city of Rosenheim in Bavaria, Germany. A closed 5G network with multiple base stations covers the test track, where connected cars can be tested under real conditions. “The automotive test bed is designed specially for developers and users that want to test new conn... » read more

Blog Review: May 11


Ansys' Vidyu Challa checks out how to identify the most important battery metrics for a particular application and trade these off against others with a focus on the important considerations when selecting the right battery for a consumer application, such as rechargeability, energy density, power density, shelf life, safety, form factor, cost, and flexibility. Cadence's Shyam Sharma points ... » read more

Week In Review: Manufacturing, Test


Acquisitions & Investments California-based MaxLinear plans to acquire Taiwan-based Silicon Motion (SMI), in a cash and stock deal valued at about $3.8 billion. Silicon Motion’s NAND flash controller technology for solid state storage devices, will extend MaxLinear’s RF, analog, and mixed signal portfolio. ISMC will invest about $3 billion in a semiconductor plant in India’s south... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility Stellantis is buying Share Now, a car sharing service owned by BMW and Mercedes-Benz. Through the acquisition, Stellantis will be adding 3.4 million car sharing customers, 10,000 vehicles, and 14 new European cities to its Free2move car sharing service, which currently has 2 million users, 2,500 vehicles, and has 7 “mobility hubs” in the U.S. and Europe. ShareNow was a... » read more

Week In Review: Design, Low Power


Rambus will acquire Hardent, a provider of design services and IP. Rambus said Hardent's silicon design, verification, compression, and Error Correction Code (ECC) expertise will provide key resources for the Rambus CXL Memory Interconnect Initiative. “Driven by the demands of advanced workloads like AI/ML and the move to disaggregated data center architectures, industry momentum for CXL-base... » read more

Rambus To Buy Hardent


Rambus inked a deal to buy Hardent, an engineering services company, in order to accelerate Rambus' push into the CXL arena. Compute Express Link (CXL), developed primarily by Intel before being turned into an open industry standard, allows memory to be disaggregated within a data center and shared across multiple servers. This, in turn, lets data centers control how critical resources are a... » read more

Blog Review: May 4


In a podcast, Arm's Geof Wheelwright chats with Steve Furber of the University of Manchester and Christian Mayr of Technische Universität Dresden about spiking neural networks and the SpiNNaker project to build a platform for realistic real-time models of brain functions. Synopsys' Licinio Sousa checks out how the MIPI protocol enables the connectivity needed for sensor fusion and increasin... » read more

Week In Review: Manufacturing, Test


It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Week In Review: Design, Low Power


Arm unveiled the Arm Cortex-M85 processor and expanded Arm Virtual Hardware to more platforms, including 3rd party devices. The Cortex-M85 is the highest performance Cortex-M processor to date, with 30% scalar performance uplift compared to the Cortex-M7, technology to support endpoint ML and DSP workloads, and includes Pointer Authentication and Branch Target Identification (PACBTI), a new arc... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility DENSO Corporation and UMC’s Japanese subsidiary United Semiconductor Japan Co., Ltd. (USJC) are collaborating on power semiconductors production for the automotive market at USJC’s 300mm fab. USJC will install an insulated gate bipolar transistor (IGBT) line at its wafer fab. Renesas Electronics uncorked an integrated automotive ECU Virtualization Platform for devel... » read more

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