category: Test, Measurement and Analytics

category: IoT, Security & Automotive

Who Owns In-Chip Monitoring Data?
By Bryon Moyer - 10 Aug, 2021 - Comments: 1

In-chip monitors provide unprecedented visibility into the inner workings of complex integrated circuits for everything from process control to fine binning, preventive system maintenance, and failure analysis. But there may be many consumers of different slices of the data at very different phases of the chip lifecycle, raising questions about who controls and owns all of that data. The ans... » read more

Multi-Layer Deep Data Performance Monitoring And Optimization
By proteanTecs - 10 Aug, 2021 - Comments: 0

Combining functional and parametric monitoring of the real-world behavior of complex SoCs provides a powerful new approach that facilitates performance optimization during development and in the field, improves security and safety, and enables predictive maintenance to prevent field failures. proteanTecs’ Universal Chip Telemetry (UCT) and Siemens’ Tessent Embedded Analytics are complementa... » read more

Characterization Of Micro-Bumps For 3DIC Wafer Acceptance Tests
By FormFactor - 10 Aug, 2021 - Comments: 0

The strong market needs to embed multiple functionalities from different semiconductor processing technologies into a single system continue to drive demands for more advanced 3DIC packaging technologies. Dimensions of copper pillar micro-bumps are consistently reduced in every new technology node to facilitate the 3D stacking of multiple dies so that overall system performance can be improved.... » read more

SLT Enables Test Content To Shift Right
By Dave Armstrong - 10 Aug, 2021 - Comments: 0

By Dave Armstrong, Davette Berry, and Craig Snyder Increasing device complexity and the continuing drive for higher levels of quality are fostering a reconsideration of test strategies. To be effective, test engineers must choose how to optimally deploy test content, from wafer probing to system-level test (SLT). A March 2019 TestConX presentation1 outlines how test content is typically allo... » read more

Residual Stress With EIGER2 R 500K
By Bruker - 10 Aug, 2021 - Comments: 0

Many manufacturing processes leave residual stresses which can affect the performance of manufactured components. Compressive stress can be engineered into a metal coating to resist crack propagation, while tensile stress can be exploited to enhance conductivity in semiconductors. Strained materials exhibit changes in atomic spacing which can be detected by X-ray diffraction (XRD) and related t... » read more

Production Testing For Silicon Photonics Wafers
By David Viera - 10 Aug, 2021 - Comments: 0

Worldwide data centers and networks for communications currently consume about 8% of the Earth’s total energy produced. To meet the increasing demands for cloud storage, computing, and various emerging applications such as artificial intelligence, genomics revolution, and video transcoding, hyperscale data centers are being built around the world at an accelerated pace, with analysts predicti... » read more

In-Line Airborne Particle Sensing Supports Faster Response To Contamination Excursions
By CyberOptics - 09 Aug, 2021 - Comments: 0

Fine particles (less than 5 micrometers in diameter) do not affect most industrial processes, but they can have a disastrous impact on semiconductor manufacturing. From the earliest days, manufacturing facilities have deployed air filtering and recirculation to remove particles from the cleanroom, but particles may still be generated inside process tools, where they can cause defects and yield ... » read more

Geo-Spatial Outlier Detection
By Anne Meixner - 19 Jul, 2021 - Comments: 0

Comparing die test results with other die on a wafer helps identify outliers, but combining that data with the exact location of an outlier offers a much deeper understanding of what can go wrong and why. The main idea in outlier detection is to find something in or on a die that is different from all the other dies on a wafer. Doing this in the context of a die’s neighbor has become easie... » read more

Automotive Innovations In Semiconductors
By Jeff Barnum - 15 Jul, 2021 - Comments: 0

By Jeff Barnum, Janay Camp, and Cathy Perry Sullivan The semiconductor industry performed better than expected in 2020 despite the impact of COVID-19 on the global economy and is preparing for accelerated growth in 2021 and beyond. The global coronavirus pandemic significantly increased demand for communications electronics and fueled the growth in cloud computing to support remote work and ... » read more

Design For Test Data
By Ed Sperling - 14 Jul, 2021 - Comments: 0

As design pushes deeper into data-driven architectures, so does test. Geir Eide, director for product management of DFT and Tessent Silicon Lifecycle Solutions at Siemens Digital Industries Software, talks with Semiconductor Engineering about a subtle but significant shift for designing testability into chips so that test data can be used at multiple stages during a device’s lifetime. » read more

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