category: Research

category: Auto, Security & Edge AI

System Bits: May 12
By Ann Mutschler - 12 May, 2015 - Comments: 0

Optomechanical tuning A new method developed by Rice University researchers for tuning the light induced vibrations of nanoparticles through slight alterations to the surface to which the particles are attached could open doors for new applications of photonics from molecular sensing to wireless communications. The researchers at Rice’s Laboratory for Nanophotonics (LANP) collaborated wit... » read more

System Bits: May 5
By Ann Mutschler - 05 May, 2015 - Comments: 0

Fight counterfeiting with fingerprint chips Given that no two human fingerprints are exactly alike, an MIT spinout uses random variations in silicon chips as authentication identifiers for consumer products. Silicon chips are similar as manufacturing processes cause microscopic variations in chips that are unpredictable, permanent, and effectively impossible to clone. MIT spinout Verayo ... » read more

Manufacturing Bits: May 5
By Mark LaPedus - 05 May, 2015 - Comments: 0

Transparent armor The U.S. Naval Research Laboratory (NRL) has developed transparent armor. The technology is actually a hard transparent ceramic, based on a material called spinel. Spinel is a magnesium aluminate compound. Spinel is also a gemstone, which could come in various colors. NRL has devised a fabrication process to create the technology, which is harder and superior to glass, sap... » read more

Power/Performance Bits: May 5
By Jesse Allen - 05 May, 2015 - Comments: 0

Single material batteries Engineers at the University of Maryland created a battery made entirely out of a single material that, by incorporating the properties of both the electrodes and electrolyte, can both move electricity and store it. The reason the new battery is revolutionary is because it solves the problem of what happens at the interface between the electrolyte and the electrod... » read more

One-On-One: Dark Possibilities
By Katherine Derbyshire - 29 Apr, 2015 - Comments: 0

Professor Michael Taylor’s research group at UC San Diego is studying ways to exploit dark silicon to optimize circuit designs for energy efficiency. He spoke with Semiconductor Engineering about the post-Dennard scaling regime, energy efficiency from integrated circuits all the way up to data centers, and how the manufacturing side can help. What follows are excerpts of that conversation. (P... » read more

System Bits: April 28
By Ann Mutschler - 28 Apr, 2015 - Comments: 0

Transistor encasing for better device performance ECE Illinois researchers have discovered a more effective method for closing gaps in atomically small wires. Led by Professor Joseph W. Lyding and graduate student Jae Won Do, the team reported this new transistor technology comprised of carbon nanotube wires shows promise in replacing silicon because it can operate 10 times as fast and is ... » read more

Manufacturing Bits: April 28
By Mark LaPedus - 28 Apr, 2015 - Comments: 0

CIA and 3D printers Voxel8, a supplier of 3D printers, has closed a strategic investment and technology development agreement with In-Q-Tel (IQT), the venture capital arm of the U.S. Central Intelligence Agency (CIA). Voxel8, founded by technologists from Harvard University, is commercializing a new platform for 3D printing. The company enables engineers to create products with embedded 3D ... » read more

Power/Performance Bits: April 28
By Jesse Allen - 28 Apr, 2015 - Comments: 0

Printing graphene aerogels Lawrence Livermore National Laboratory researchers have made graphene aerogel microlattices with an engineered architecture via a 3D printing technique known as direct ink writing, potentially leading to better energy storage, sensors, and nanoelectronics. Aerogel is a synthetic porous, ultralight material derived from a gel, in which the liquid component of the... » read more

Manufacturing Bits: April 21
By Mark LaPedus - 21 Apr, 2015 - Comments: 0

Fan-out packaging consortium A*STAR’s Institute of Microelectronics (IME) and others have formed a high-density fan-out wafer level packaging (FOWLP) consortium in Singapore. Others in the group include Amkor, Nanium, STATS ChipPAC, NXP, GlobalFoundries, Kulicke & Soffa, Applied Materials, Dipsol Chemicals, JSR, KLA-Tencor, Kingyoup Optronics, Orbotech and Tokyo Ohka Kogyo (TOK). T... » read more

Power/Performance Bits: April 21
By Jesse Allen - 21 Apr, 2015 - Comments: 0

Harvesting more electromagnetic energy Researchers from the University of Waterloo in Canada showed for the first time that it's possible to collect essentially all of the electromagnetic energy that falls onto a surface. Their approach involves the use of metamaterials that can be tailored to produce media that neither reflects nor transmits any power, enabling full absorption of incident w... » read more

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