category: System-Level Design

category: Auto, Security & Edge AI

Week In Review: Design, Low Power
By Jesse Allen - 19 Apr, 2019 - Comments: 0

Intel acquired vision and video FPGA IP company Omnitek. Founded in 1998, the Basingstoke, England-based company has produced FPGA IP cores for video processing including conversion and enhancement, creating arbitrary image warps on a real time video stream, connectivity, and deep learning and AI inferencing. Terms of the deal were not disclosed. Qualcomm and Apple have dropped all litigatio... » read more

The Role Of EDA In AI
By Brian Bailey - 17 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the role that EDA has in automating artificial intelligence and machine learning with Doug Letcher, president and CEO of Metrics; Daniel Hansson, CEO of Verifyter; Harry Foster, chief scientist verification for Mentor, a Siemens Business; Larry Melling, product management director for Cadence; Manish Pandey, Synopsys fellow; and Raik Brinkmann, CEO ... » read more

Blog Review: April 17
By Jesse Allen - 17 Apr, 2019 - Comments: 0

In a video, Mentor's Colin Walls digs into power management in embedded software with a particular look at the Power Pyramid model. Synopsys' Taylor Armerding checks out the state of application security at this year's RSA and finds that while organizations are paying attention to security through training and dedicated teams, roadblocks still remain. Cadence's Paul McLellan considers how... » read more

EDA, IP Revenue Down
By Ed Sperling - 15 Apr, 2019 - Comments: 0

EDA and IP revenue dropped 3.1% in Q4 2018 to $2.570 billion, versus $2.652 billion in the same period in 2017, ending a streak of 11 consecutive positive quarters of growth, according to the statistics released today by the Electronic System Design (ESD) Alliance. One quarter doesn't indicate a trend, but it certainly gets everyone's attention after nearly three years of positive news. Now ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 12 Apr, 2019 - Comments: 0

IP Flex Logix debuted its new InferX X1 edge inference co-processor, which incorporates the interconnect technology from its eFPGAs and its inference-optimized nnMAX clusters. The chip focuses on high throughput in edge applications with a single DRAM and is optimized for small batch sizes in edge applications where there is typically only one camera/sensor. InferX X1 will be available as chip... » read more

From AI Algorithm To Implementation
By Brian Bailey - 10 Apr, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss the role that EDA has in automating artificial intelligence and machine learning with Doug Letcher, president and CEO of Metrics; Daniel Hansson, CEO of Verifyter; Harry Foster, chief scientist verification for Mentor, a Siemens Business; Larry Melling, product management director for Cadence; Manish Pandey, Synopsys fellow; and Raik Brinkmann, CEO ... » read more

Blog Review: April 10
By Jesse Allen - 10 Apr, 2019 - Comments: 0

Arm's Paul Whatmough discusses the growing use of real-time computer vision on mobile devices and proposes transfer learning as a way to enable neural network workloads on resource-constrained hardware. Cadence's Anton Klotz highlights a collaboration with Imec and TU Eindhoven on cell-aware test that reduces defect simulation time by filtering out defects with equivalent fault effects. M... » read more

System Bits: April 8
By Jeff Dorsch - 08 Apr, 2019 - Comments: 0

Computers trained to design materials Researchers in the University of Missouri’s College of Engineering are applying deep learning technology to educate high-performance computers in the field of materials science, with the goal of having those computers design billions of potential materials. “You can train a computer to do what it would take many years for people to otherwise do,” ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Apr, 2019 - Comments: 0

Tools & IP Cadence entered the system design and analysis market with the release of Clarity 3D Solver, which creates S-parameter models for use in signal integrity, power integrity, and electromagnetic compliance analysis. The tool uses a distributed adaptive meshing approach for cloud and on-premises distributed computing and it optimized to distribute a job across multiple low-cost comp... » read more

Blog Review: April 3
By Jesse Allen - 03 Apr, 2019 - Comments: 0

Synopsys' Taylor Armerding contends that as the IoT becomes more ubiquitous, the threat of cyber-physical attacks is rising, with the potential for a domino effect if even simple devices are compromised in large enough quantities. Mentor's Colin Walls considers the move away from programming on bare metal with the rise of drivers and RTOSes and when it makes sense to still use the old method... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2026 SMG   |  Terms of Service  |  Privacy Policy