Programmable Hardware Delivers 10,000X Improvement In Verification Speed Over Software For Forward Error Correction


In the race to increase the speeds of wireline networking and communications, forward error correction (FEC) has become a vital part of the toolkit. To function effectively, especially with the increasing use of four-level pulse amplitude modulation (PAM4), high-speed protocols need FEC to avoid a rise in the number of reception errors. Each incremental increase in the transmitted symbol rate r... » read more

Security Vulnerabilities Difficult To Detect In Verification Flow


As designs grow in complexity and size, the landscape for potential hackers to infiltrate a chip at any point in either the design or verification flow increases commensurately. Long considered to be a “safe” aspect of the design process, verification now must be a focus of chip developers from a security perspective. This also means the concept of trust has never been higher, and the tr... » read more

3D Packaging vs 3D Integration eBook


In this eBook, you will: •    Explore the background and trends of multi-die packages •    Learn about the distinct approaches of 3D packaging and 3D integration •    Examine the challenges within heterogeneous integration Read more here. » read more

Blog Review: June 25


Siemens’ John McMillan provides a detailed overview of 3D-IC technology and heterogeneous integration, from the market trends driving its adoption to the design, verification, and manufacturing challenges involved. Synopsys’ Gunnar Braun and Stewart Williams check out how cloud-based development practices and virtual prototypes can enable earlier and more efficient testing and validation... » read more

Design and Test Solutions for E-Mobility and Autonomous Driving


The automotive industry is accelerating its electronic technology revolution and fusing with the clean energy ecosystem. By 2030, 4.2 million cars will be autonomous and 50% will be electric. Dramatic increases in the number of sensors and applications in new automobiles have evolved the vehicle from a peripheral role to a network hosting clusters of connected devices. Cars now need to be o... » read more

EDA’s Top Execs Map Out An AI-Driven Future


Artificial intelligence is permeating the entire semiconductor ecosystem, forcing fundamental changes in AI chips, the design tools used to create them, and the methodologies used to ensure they will work reliably. This is a global race that will redefine nearly every domain over the next decade. In presentations and interviews over the past several months, top EDA executives converged on th... » read more

Can You Build A Known-Good Multi-Die System?


Semiconductor Engineering sat down to discuss the challenges of designing and testing multi-die systems, including how to ensure they will work as expected, with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadenc... » read more

Blog Review: June 18


Synopsys’ John Koeter and other industry experts discuss whether high-bandwidth memory should follow established standards for broad compatibility and scalability or be customized to address specific use case requirements and time-to-market targets. In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about how progress in 3D-IC development, thermal management, and the indu... » read more

Agentic AI In Chip Design


Large language models (LLMs) like ChatGPT are just the starting point for generating content with AI. The next phase will be about harnessing LLMs with agents, providing automated feedback and improvements in performance and accuracy. Mehir Arora, backend engineer at ChipAgents, talks about the impact this can have on EDA and chip design, allowing smaller teams to compete with larger teams, and... » read more

Blog Review: June 4


In a podcast, Siemens’ Conor Peick, Dale Tutt, and Mike Ellow chat about the implications of the software-defined transition, how it affects semiconductor development, and why it seems to be leading more companies towards developing their own silicon. Cadence’s Vinod Khera shows off a Linux-based audio development platform for prototyping AI audio applications with support for real-time ... » read more

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