Ansys Buys Apache


By Ed Sperling Ansys plans to acquire Apache Design Solutions, rounding out its lineup of simulation software with expertise in low-power analysis. Ansys will pay $310 million in cash, which includes $29 million in cash that Apache already has on its books. The timing is particularly interesting because Apache announced its plans to go public with a $75 million IPO in March. The last compan... » read more

Management Buys Into ESL


By Jon McDonald Over the past few weeks I've spent a significant amount of time at industry shows, the largest of which is DAC. It was interesting to hear the tone of the conversations this year around ESL. ESL has reached a level of acceptance such that it is now being co-opted and interpreted to cover an amazing array of activities. I have felt for a while that the electronic design indus... » read more

Our STBs Really Suck (Power)


By Kurt Shuler For all the work our industry does to implement sophisticated power management and conservation features in our chips and software, I was dismayed (and a little appalled) to read Saturday’s New York Times article, “Atop TV Sets, a Power Drain That Runs Nonstop.” Our industry’s dirty little secret is out, with help from the National Resources Defense Council (NRDC) and... » read more

What’s A Subsystem?


The interchangeability of IP has proved to be a myth. While large companies have been able to tap into their internally developed IP quite successfully, the ability to use commercially available IP has proved to be limited—particularly outside of the standard IP world. That will change, but not in the way most of the small IP companies actually expected. While the barrier to entry for deve... » read more

Phased Loops


One thing that became clear at DAC this year is that the next big collision won’t be the technology itself. It will be the business infrastructure that supports the technology. The integration of IP, software, subsystems, and ultimately entire die and packages will have a major impact on the chip industry on all levels. For some companies it will be good. For others it will be bad. But for... » read more

Tech Talk: Sonics CTO


Drew Wingard peels back the covers on dark silicon, the next big thing in semiconductors and what's needed to get there in a candid discussion with System-Level Design. [youtube vid=ciWTa2HGCkE] » read more

Executive Briefing: Naveed Sherwani


Open-Silicon's CEO talks with System-Level Design about getting the business priorities of designing a complex SoC in line with the technology; why getting chips out the door on time is critical and why it's not happening. [youtube vid=OAQ9JxJKYHU] » read more

Tech Talk: Atrenta CTO


Bernard Murphy talks with System-Level Design about what's changing in the semiconductor design area, how 3D stacking will affect design and what's needed in EDA tools. [youtube vid=kT3vs4sldSk] » read more

Executive Briefing: Jack Harding


eSilicon's CEO talks with System-Level Design about changes in design at advanced nodes, the power of 2.5D and 3D stacking, and how the semiconductor supply chain is changing.   [youtube vid=HlipMzgdksc]   » read more

Redefining ‘Good Enough’


The old definition of a good chip was that it could be manufactured with reasonable yield, it was functionally solid, and it performed at least as well as the market demanded. That definition is changing, however. There will always be a difference between ‘good’ and ‘good enough.’ We all want to own the ‘good’ chips in our electronic devices. But what’s noteworthy are the chang... » read more

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