eSilicon’s CEO talks with System-Level Design about changes in design at advanced nodes, the power of 2.5D and 3D stacking, and how the semiconductor supply chain is changing.
Data and protocol interoperability standards are needed for EDA tools, and there are more hurdles ahead. Customized chiplets will be required for AI applications.
The promise of photonics ICs is spurring innovation, but complex processes and a lack of open foundries are keeping it from reaching its full potential.
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