category: Technical Papers

category: Auto, Security & Edge AI

Current Knowledge & Future Development In 2D Magnetic Materials Research
By Technical Paper Link - 26 Apr, 2022 - Comments: 0

Abstract: "Magnetism in two-dimensional (2D) van der Waals (vdW) materials has recently emerged as one of the most promising areas in condensed matter research, with many exciting emerging properties and significant potential for applications ranging from topological magnonics to low-power spintronics, quantum computing, and optical communications. In the brief time after their discovery, 2D... » read more

Pyrolyzed Cellulose Nanofiber Paper (CNP) Semiconductor with a 3D Network Structure
By Technical Paper Link - 26 Apr, 2022 - Comments: 0

Abstract Semiconducting nanomaterials with 3D network structures exhibit various fascinating properties such as electrical conduction, high permeability, and large surface areas, which are beneficial for adsorption, separation, and sensing applications. However, research on these materials is substantially restricted by the limited trans-scalability of their structural design and tunability of... » read more

Artificial intelligence deep learning for 3D IC reliability prediction
By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research from National Yang Ming Chiao Tung University, National Center for High-Performance Computing (Taiwan), Tunghai University, MA-Tek Inc, and UCLA. Abstract "Three-dimensional integrated circuit (3D IC) technologies have been receiving much attention recently due to the near-ending of Moore’s law of minimization in 2D IC. However, the reliability of 3D IC, which is greatly infl... » read more

Efficacy of Transistor Interleaving in DICE Flip-Flops at a 22 nm FD SOI Technology Node
By Technical Paper Link - 25 Apr, 2022 - Comments: 0

New research paper from University of Saskatchewan, with funding by NSERC and the Cisco University Research Program. Abstract "Fully Depleted Silicon on Insulator (FD SOI) technology nodes provide better resistance to single event upsets than comparable bulk technologies, but upsets are still likely to occur at nano-scale feature sizes, and additional hardening techniques should be explor... » read more

Hardware-Supported Patching of Security Bugs in Hardware IP Blocks
By Technical Paper Link - 22 Apr, 2022 - Comments: 0

New research paper from Duke University, University of Calgary, NYU & Intel. Abstract: "To satisfy various design requirements and application needs, designers integrate multiple Intellectual Property blocks (IPs) to produce a system-on-chip (SoC). For improved survivability, designers should be able to patch the SoC to mitigate potential security issues arising from hardware IPs; for incre... » read more

Stress tensor mesostructures for deterministic figuring of thin substrates
By Technical Paper Link - 21 Apr, 2022 - Comments: 0

New research paper from MIT and University of Arizona, funded by NASA. Abstract "Accessing the immense value of freeform surfaces for mass-sensitive applications such as space optics or metaform optical components requires fabrication processes that are suited to figuring thin substrates. We present stress tensor mesostructures for precisely correcting figure errors, even after microstruc... » read more

van der Waals Semiconductor Empowered Vertical Color Sensor
By Technical Paper Link - 20 Apr, 2022 - Comments: 0

Abstract "Biomimetic artificial vision is receiving significant attention nowadays, particularly for the development of neuromorphic electronic devices, artificial intelligence, and microrobotics. Nevertheless, color recognition, the most critical vision function, is missed in the current research due to the difficulty of downscaling of the prevailing color sensing devices. Conventional colo... » read more

FLODAM: Cross-Layer Reliability Analysis Flow for Complex Hardware Designs
By Technical Paper Link - 20 Apr, 2022 - Comments: 0

Abstract "Modern technologies make hardware designs more and more sensitive to radiation particles and related faults. As a result, analysing the behavior of a system under radiation-induced faults has become an essential part of the system design process. Existing approaches either focus on analysing the radiation impact at the lower hardware design layers, without further propagating any rad... » read more

Memory Bandwidth Regulation on Hybrid NVM/DRAM Platforms
By Technical Paper Link - 20 Apr, 2022 - Comments: 0

New technical paper from Shanghai Jiao Tong University Abstract "Non-volatile memory (NVM) has emerged as a new memory media, resulting in a hybrid NVM/DRAM configuration in typical servers. Memory-intensive applications competing for the scant memory bandwidth can yield degraded performance. Identifying the noisy neighbors and regulating the memory bandwidth usage of them can alleviate th... » read more

A Novel Power-Saving Reversing Camera System with Artificial Intelligence Object Detection
By Technical Paper Link - 20 Apr, 2022 - Comments: 1

Abstract "According to a study by the Insurance Institute for Highway Safety (IIHS), the driving collision rate of using only the reversing camera system is lower than that of using both the reversing camera system and the reversing radar. In this article, we implemented a reversing camera system with artificial intelligence object detection to increase the information of the reversing image... » read more

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