category: Top Stories

category: Auto, Security & Edge AI

2.5D, FO-WLP Issues Come Into Focus
By Ann Mutschler - 10 Apr, 2017 - Comments: 2

Advanced packaging is beginning to take off after years of hype, spurred by 2.5D implementations in high-performance markets and fan-out wafer-level packaging for a wide array of applications. There are now more players viewing packaging as another frontier driving innovation. But perhaps a more telling sign is that large foundries in Taiwan have begun offering packaging services to customer... » read more

How Testing MEMS, Sensors Is Different
By Jeff Dorsch - 10 Apr, 2017 - Comments: 2

When it comes to testing microelectromechanical system devices and sensors, sometimes you have to shake and bake. [getkc id="311" comment="MEMS"] and [getkc id="187" kc_name="sensors"] are physically different from standard ICs. They require a specific type of stimulus to get the required testing results. Most chips only need to have an electrical charge run through them to gauge their pass/... » read more

Electroplating IC Packages
By Mark LaPedus - 10 Apr, 2017 - Comments: 2

The electrochemical deposition (ECD) equipment market for IC packaging is heating up as 2.5D, 3D and fan-out technologies begin to ramp. [getentity id="22817" e_name="Applied Materials"]  recently rolled out an ECD system for IC packaging. In addition, Lam Research, TEL and others compete in the growing but competitive ECD equipment market for packaging. ECD—sometimes referred to as pl... » read more

Self-Driving Cars Rattle Supply Chain
By Ann Mutschler - 06 Apr, 2017 - Comments: 0

Automotive compute workloads are consolidating as carmakers push toward autonomous vehicles, but the changes necessary to make this all work are causing huge disruptions in an industry that has fine-tuned its supply chain over more than a century. Consolidation is essential for a variety of reasons, including efficiency of the computations, complexity management, and lower deployment costs. ... » read more

LiDAR Completes Sensing Triumvirate
By Jeff Dorsch - 06 Apr, 2017 - Comments: 3

Fully autonomous vehicles of the future will depend on a combination of different sensing technologies – advanced vision systems, radar, and light imaging, detection, and ranging (LiDAR). Of the three, LiDAR is now the costliest part of that equation, and there are worldwide efforts to bring down those costs. Mechanical LiDAR units are currently available, priced in the hundreds of dollars... » read more

Security: Losses Outpace Gains
By Ed Sperling - 06 Apr, 2017 - Comments: 0

Paul Kocher, chief scientist in [getentity id="22671" e_name="Rambus'"] Cryptography Research Division, sat down with Semiconductor Engineering to discuss the new threats to security, artificial intelligence and machine learning, and how to engineer a secure system. What follows are excerpts of that conversation. SE: Where are we with security? It seems that rather than getting better, thing... » read more

Conflicting Goals In Data Centers
By Gale Morrison - 06 Apr, 2017 - Comments: 0

Two conflicting goals are emerging inside of data centers—speed at any cost, and the ability to extend hardware well beyond its expected lifetime to amortize that cost. Layered across both of those are concerns about how to move data back and forth more efficiently, how to secure it, and how to best integrate different generations of technology. But these widely different goals have create... » read more

Inside Lithography And Masks
By Mark LaPedus - 05 Apr, 2017 - Comments: 3

Semiconductor Engineering sat down to discuss lithography and photomask technologies with Gregory McIntyre, director of the Advanced Patterning Department at [getentity id="22217" e_name="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; David Fried, chief technology officer at [getentity id="22210" e_name="Cove... » read more

The Great Machine Learning Race
By Ed Sperling - 03 Apr, 2017 - Comments: 2

Processor makers, tools vendors, and packaging houses are racing to position themselves for a role in machine learning, despite the fact that no one is quite sure which architecture is best for this technology or what ultimately will be successful. Rather than dampen investments, the uncertainty is fueling a frenzy. Money is pouring in from all sides. According to a new Moor Insights report,... » read more

HBM Upstages DDR In Bandwidth, Power
By Ann Mutschler - 30 Mar, 2017 - Comments: 1

For graphics, networking, and high performance computing, the latest iteration of high-bandwidth memory (HBM) continues to rise up as a viable contender against conventional DDR, GDDR designs, and other advanced memory architectures such as the Hybrid Memory Cube. [getkc id="276" kc_name="HBM"] enables lower power consumption per I/O and higher bandwidth memory access with a more condensed f... » read more

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