category: Top Stories

category: Auto, Security & Edge AI

Inside Next-Gen Transistors
By Mark LaPedus - 20 Apr, 2017 - Comments: 0

David Fried, chief technology officer at [getentity id="22210" e_name="Coventor"], sat down with Semiconductor Engineering to discuss the IC industry, China, scaling, transistors and process technology. What follows are excerpts of that conversation. SE: In a recent roundtable discussion you talked about some of the big challenges facing the IC industry. One of your big concerns involves th... » read more

Moore’s Law: A Status Report
By Ed Sperling - 20 Apr, 2017 - Comments: 3

Moore's Law has been synonymous with "smaller, faster, cheaper" for the past 52 years, but increasingly it is viewed as just one of a number of options—some competing, some complementary—as the chip industry begins zeroing in on specific market needs. This does not make [getkc id="74" comment="Moore's Law"] any less relevant. The number of companies racing from 16/14nm to 7nm is higher t... » read more

Cloud Computing Chips Changing
By Ann Mutschler - 19 Apr, 2017 - Comments: 1

An explosion in cloud services is making chip design for the server market more challenging, more diverse, and much more competitive. Unlike datacenter number crunching of the past, the cloud addresses a broad range of applications and data types. So while a server chip architecture may work well for one application, it may not be the optimal choice for another. And the more those tasks beco... » read more

Supporting CPUs Plus FPGAs (Part 3)
By Brian Bailey - 19 Apr, 2017 - Comments: 0

While it has been possible to pair a CPU and FPGA for quite some time, two things have changed recently. First, the industry has reduced the latency of the connection between them and second, we now appear to have the killer app for this combination. Semiconductor Engineering sat down to discuss these changes and the state of the tool chain to support this combination, with Kent Orthner, system... » read more

The Hunt For A Low-Power PHY
By Brian Bailey - 17 Apr, 2017 - Comments: 0

Physics has been on the side of chipmakers throughout most of the lifetime of [getkc id="74" comment="Moore's Law"], but when dealing with the world outside the chip, physics is working against them. Pushing data at ever-faster rates through boards and systems consumes increasing amounts of power, but the power budget for chips has not been increasing. Could chips be constrained by their int... » read more

The Problem With Clocks
By Brian Bailey - 13 Apr, 2017 - Comments: 1

The synchronous digital design paradigm has enabled us to design circuits that are well controlled, but that is only true if the clocks themselves are well controlled. While overdesign techniques ensured that to be the case in early ASIC development, designs today cannot afford such luxuries. As we strive for lower power and higher operating frequencies, the clock has become a critical desig... » read more

Managing Voltage Drop At 10/7nm
By Ann Mutschler - 13 Apr, 2017 - Comments: 0

Power integrity is becoming a bigger problem at 10/7nm because existing tools such as static analysis no longer are sufficient. Power integrity is a function of static and dynamic voltage drop in the power delivery network. And until recently, static analysis did an effective job in measuring the overall robustness of PDN connectivity. As such, it is a proxy for PDN strength. The problem is ... » read more

Electric Vehicles Set The Pace
By Gale Morrison - 13 Apr, 2017 - Comments: 0

Electric vehicles are leading the charge for innovation in automotive electronics. Companies that invested and embraced the challenge of EVs are besting their less-nimble, less-open-minded engineering cohorts. Semiconductors and embedded computers have been controlling the dashboard, mirrors, seats, heating and cooling for years. But with EVs, engineering teams are starting to tackle tas... » read more

Time For Massively Parallel Testing
By Jeff Dorsch - 12 Apr, 2017 - Comments: 0

Time is money in electronics, as in other industries, and the more time that is invested in testing chips means more costs being added to the product in question. To speed up testing for memory devices and other semiconductors, test equipment vendors have resorted to parallel testing technology, simultaneously testing multiple chips at a time. The industry also is turning to system-level tes... » read more

Supporting CPUs Plus FPGAs
By Brian Bailey - 11 Apr, 2017 - Comments: 5

While it has been possible to pair a CPU and FPGA for quite some time, two things have changed recently. First, the industry has reduced the latency of the connection between them and second, we now appear to have the killer app for this combination. Semiconductor Engineering sat down to discuss these changes and the state of the tool chain to support this combination, with Kent Orthner, system... » read more

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