Smart Manufacturing Gains Momentum


Smart manufacturing is gaining traction as a way of addressing increased market fragmentation while still leveraging economies of scale. The goal is to add a level of flexibility into manufacturing processes that until recently was considered impossible. Although the approach makes sense in theory, real-world implementation is proving far from consistent. Sometimes referred to as Industr... » read more

Prioritizing Vehicle Data Traffic


It’s no surprise to hear that data complexity is on the rise inside vehicles today, but the scale just might cause you to gag on your coffee. It's expected that a fully connected car will upload as much as 30 gigabytes of data to the cloud every hour. Given the scale of data, it is imperative to make sure every bit of it is classified and tagged properly so that the subsystems, and inf... » read more

Making Secure Chips For IoT Devices


Chips and modules going into Internet of Things node devices must have cybersecurity features designed and built into them. Multiple vendors are responding with products meant to keep the IoT devices protected from the cyberattacks that are becoming more common. While [getkc id="76" kc_name="IoT"] privacy remains a key concern for consumers and homeowners, IoT security has taken on top-of-mi... » read more

Things To Come This Year


What will happen in the Internet of Things during 2017? No one truly knows. Some 2016 trends can be teased out to provide prognostications for the 12 months ahead. Parks Associates released a white paper in December, “Top 10 Consumer IoT Trends in 2017,” which notes that U.S. broadband households have an average of more than eight connected computing, entertainment, and mobile devices, a... » read more

BEOL Issues At 10nm And 7nm (part 2)


Semiconductor Engineering sat down to discuss problems with the back end of line at leading-edge nodes with Craig Child, senior manager and deputy director for [getentity id="22819" e_name="GlobalFoundries'"] advanced technology development integration unit; Paul Besser, senior technology director at [getentity id="22820" comment="Lam Research"]; David Fried, CTO at [getentity id="22210" e_name... » read more

More Reactive, Less Warming


As mentioned in Part 4 of Semiconductor Engineering's series on fab sustainability, molecular fluorine is one alternative to PFCs or NF3 for CVD chamber cleaning in the integrated circuit and flat panel display industries. It has a number of advantages relative to NF3: an unstable, highly reactive molecule, F2 breaks down easily and has no global warming potential.  When NF3 is used, atomic... » read more

Overcoming The Limits Of Scaling


Semiconductor Engineering sat down to discuss the increasing reliance on architectural choices for improvements in power, performance and area, with [getperson id="11425" comment=" Sundari Mitra"], CEO of [getentity id="22535" comment="NetSpeed Systems"]; Charlie Janac, chairman and CEO of [getentity id="22674" e_name="Arteris"]; [getperson id="11032" comment="Simon Davidmann"] CEO of [getentit... » read more

Architect Specs Harder To Follow


Interpreting and implementing architects' specifications is getting harder at each new process node, which is creating problems throughout the design flow, into manufacturing, and sometimes even post-production. Rising complexity and difficulties in scaling have pushed much more of the burden onto architects to deal with everything from complex power schemes, new packaging approaches, and to... » read more

CEO Outlook: Chip Design 2017


After two consecutive flat to slightly down years, the semiconductor industry is poised for growth in 2017. Cowan this month predicted 4.7% growth in semiconductor sales in 2017, while World Semiconductor Trade Statistics (WSTS) put that figure at 3.3%. And last month, International Business Strategies (IBS) pegged the number at 4.6%, according to statistics compiled by the Global Semiconduc... » read more

What’s Missing In Advanced Packaging


Even though Moore's Law is running out of steam, there is still a need to increase functional density. Increasingly, this is being done with heterogeneous integration at the package or module level. This is proving harder than it looks. At this point there are no standardized methodologies, and tools often are retrofitted versions of existing tools that don't take into account the challenges... » read more

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