Virtual Prototyping Takes Off


By Ann Steffora Mutschler Skyrocketing software development costs, which for years have been “somebody else’s problem,” are now firmly part of the SoC development teams list of headaches. That has made virtual prototyping far more popular, particularly at 40nm and beyond, where engineers are looking at this approach as a way of managing complexity, doing architectural exploration and eve... » read more

The Tao Of Software


By Ed Sperling and Pallab Chatterjee As software teams continue to race past hardware teams in numbers of engineers, hours spent on designs and NRE budgets, companies are beginning to question whether there needs to be a fundamental shift in priorities and strategy. The problem is that it takes far too long to write and debug the software and to get it working on the hardware, even with vir... » read more

5 Ways To Cut Power


By Ed Sperling Low energy consumption with minimal leakage has emerged as the most competitive element in an IC design, regardless of whether it involves a plug, a battery, or whether it’s powered by a gasoline engine. While components on an SoC aren’t always power-aware, they’ll have to be in the future as consumers focus first on energy efficiency. With rising fuel costs, a concern ... » read more

System Models Are Changing


By Pallab Chatterjee Historically system-level modeling was based on making sure there were no timing crashes on the main data bus. After that it was multi-core conflict resolution, distributed memory routing and, most recently, verifying the correct core actually has access to the correct memory with the data that is relevant being available. All of these areas are now subject to an additi... » read more

Too Soon For Wide I/O


By Ann Steffora Mutschler When 3D ICs are prevalent, Wide I/O is sure to be there. But where does the technology stand today? Considering the amount of buzz and hype, it would be easy believe it is being implemented in production designs today. Wide I/O is a very brute-force way of solving the problem of trying to get latency down with a high-speed memory interface, explained Navraj Nandra,... » read more

Managing Physical Effects


By Ann Steffora Mutschler Managing the physical effects from manufacturing is becoming increasingly critical as designs grow in size and process geometries dive lower. Just keeping track of these effects in a billion-gate design is a daunting task. At advanced manufacturing nodes, the capacitance and inductance effects make the design much harder—and that includes both on-die and off-die ... » read more

Who’s In Control?


By Ed Sperling A power shift is under way across the SoC world that ultimately determine who wins the business, who gets the biggest share and what technologies are ultimately used to get there. Complexity has reached a point where being able to pull the necessary pieces from a disaggregated supply chain is becoming much more difficult. That helps explain why all three of the major EDA comp... » read more

Infrastructure Needed For The “Internet Of Things”


By Pallab Chatterjee There has been a lot of buzz about the “Internet of Things” (IoT), the world being “constantly connected,” “wireless everywhere” and “ubiquitous connectivity.” These are great ideas and they’re driving the development of mobile and sensor-based devices. However, for the data to show up someplace, whether it is the cloud or a private repository, data netwo... » read more

Tri-Gate’s Fallout


By David Lammers Intel Corp. dropped a rock into the pond of transistor technology when it announced its 22nm tri-gate technology in San Francisco earlier this month. The ripples continue to move out from that event, with impacts on IDMs, foundries, and fabless semiconductor companies being closely studied. Now that Intel has come out of the closet with its tri-gate technology, “the found... » read more

The Upside Of Dark Silicon


By Ed Sperling For many years the real challenge in IC design was in shrinking the components and features on a piece of silicon without burning up the chip or destroying signal integrity. Chipmakers have become quite adept at this over the past few decades. Too good, in fact. Now they are faced with a different kind of problem—what to do with all that extra silicon. Just as the long dist... » read more

← Older posts Newer posts →