Integrated phononic waveguide on thin-film lithium niobate on diamond; aZnMIm resist for EUV lithography; TMDC multi-channel GAA-FET architectures at sub-1nm; HW trojans detection using GNNs; agentic approach for SoC security verification; SiCN wafer bonding for 3D integration; PFAS in semiconductor manufacturing; patterned MW-NSFET with GAA and wrap-around contact.
New technical papers recently added to Semiconductor Engineering’s library:
| Name of Paper | Research Organizations |
|---|---|
| Integrated phononic waveguide on thin-film lithium niobate on diamond | Stanford University and UC Santa Barbara |
| Patterned Multi-Wall Nanosheet FETs for Sustainable Scaling: Zero Gate Extension With Minimal Gate Cut Width | POSTECH |
| Extreme Ultraviolet and Beyond Extreme Ultraviolet Lithography using Amorphous Zeolitic Imidazolate Resists Deposited by Atomic/Molecular Layer Deposition | Johns Hopkins Univ., Northwestern Univ., Intel Corp, Bruker Nano, EUV Tech and Lawrence Berkeley National Lab |
| Exploring optimal TMDC multi-channel GAA-FET architectures at sub-1nm nodes | Sungkyunkwan University and Alsemy Inc |
| TROJAN-GUARD: Hardware Trojans Detection Using GNN in RTL Designs | University of Connecticut and University of Minnesota |
| SV-LLM: An Agentic Approach for SoC Security Verification using Large Language Models | University of Florida |
| Material-Mechanistic Interplay in SiCN Wafer Bonding for 3D Integration | Yokohama National University, TEL, SK hynix, and University of Tsukuba |
| Practical Guidance on Selecting Analytical Methods for PFAS in PFAS in Semiconductor Manufacturing Wastewater | Oregon State University |
Find more semiconductor research papers here.
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