tag: 3D-IC

Photonic Debond: Scalability And Advancements
By Brewer Science - 17 May, 2023 - Comments: 0

Advanced packaging technology has continuously evolved over the past 10-20 years to become a major driving force in improving integrated circuit (IC) performance. This improvement in IC performance is assisted by the ability to place specialized components near each other for shorter interconnects in the IC packages. Temporary bond and debond (TB/DB) is an enabling technique for this work. TB/D... » read more

Circuit Design For Industry 4.0
By Bjorn Zeugmann - 11 May, 2023 - Comments: 0

By Björn Zeugmann and Olaf Enge-Rosenblatt The digitalization of industry is progressing in leaps and bounds, albeit not at the same speed everywhere. In many industries, processes can be digitalized well to very well — for example, because electronic control systems can be retrofitted from analog to digital relatively easily. In some cases, new industries emerge only because processes ha... » read more

3D-IC Design: An Innovative Approach To Chip Integration
By Akanksha Soni - 11 May, 2023 - Comments: 0

Advancements in technology have led to the development of increasingly complex and densely integrated circuits (ICs). To keep up with the ever-growing demand for high-performance and power-efficient devices, the industry has shifted toward 3D-IC design. 3D-ICs have many applications in a wide range of industries, including consumer electronics, telecommunications, computing, and automotive. Wh... » read more

True 3D-IC Problems
By Brian Bailey - 27 Apr, 2023 - Comments: 0

Placing logic on logic may sound like a small step, but several problems must be overcome to make it a reality. True 3D involves wafers stacked on top of each other in a highly integrated manner. This is very different from 2.5D integration, where logic is placed side-by-side, connected by an interposer. And there are some intermediate solutions today where significant memory is stacked on l... » read more

Thermal Integrity Challenges Grow In 2.5D
By Ann Mutschler - 13 Apr, 2023 - Comments: 3

Thermal integrity is becoming much harder to predict accurately in 2.5D and 3D-IC, creating a cascade of issues that can affect everything from how a system behaves to reliability in the field. Over the past decade, silicon interposer technology has evolved from a simple interconnect into a critical enabler for heterogeneous integration. Interposers today may contain tens of dies or chiplets... » read more

3D-IC: Operator Learning Framework For Ultra-Fast 3D Chip Thermal Prediction Under Multiple Chip Design Configurations
By Technical Paper Link - 24 Mar, 2023 - Comments: 0

A new technical paper titled "DeepOHeat: Operator Learning-based Ultra-fast Thermal Simulation in 3D-IC Design" was published (preprint) by researchers at UCSB and Cadence. Abstract "Thermal issue is a major concern in 3D integrated circuit (IC) design. Thermal optimization of 3D IC often requires massive expensive PDE simulations. Neural network-based thermal prediction models can perform ... » read more

True 3D Is Much Tougher Than 2.5D
By Brian Bailey - 23 Mar, 2023 - Comments: 0

Creating real 3D designs is proving to be much more complex and difficult than 2.5D, requiring significant innovation in both technology and tools. While there has been much discussion about 3D designs, there are multiple interpretations about what 3D entails. This is more than just semantics, however, because each packaging option requires different design approaches and technologies. And a... » read more

The Race Toward Mixed-Foundry Chiplets
By Ann Mutschler - 23 Mar, 2023 - Comments: 1

Creating chiplets with as much flexibility as possible has captured the imagination of the semiconductor ecosystem, but how heterogeneous integration of chiplets from different foundries will play out remains unclear. Many companies in the semiconductor ecosystem are still figuring out how they will fit into this heterogeneous chiplet world and what issues they will need to solve. While near... » read more

Room-Temperature Metal Bonding Technology That Facilitates The Fabrication of 3D-ICs & 3D Integration With Heterogeneous Devices
By Technical Paper Link - 19 Mar, 2023 - Comments: 0

A technical paper titled "Room-Temperature Direct Cu Semi-Additive Plating (SAP) Bonding for Chip-on-Wafer 3D Heterogenous Integration With μLED" was published by researchers at Tohoku University in Japan. Abstract: "This letter describes a direct Cu bonding technology to there-dimensionally integrate heterogeneous dielets based on a chip-on-wafer configuration. 100- μm -cubed blue μ LED... » read more

Improving Performance And Power With HBM3
By Andy Patrizio - 30 Jan, 2023 - Comments: 0

HBM3 swings open the door to significantly faster data movement between memory and processors, reducing the power it takes to send and receive signals and boosting the performance of systems where high data throughput is required. But using this memory is expensive and complicated, and that likely will continue to be the case in the short term. High Bandwidth Memory 3 (HBM3) is the most rece... » read more

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