Equipment Market Drifts Downward


Most analysts covering the equipment market have dropped their forecasts, some by as much as half, since the start of the year. While there are a number of variables that could ultimately change those numbers—the Greek debt crisis, currency fluctuations, server sales, the delivery of a commercially viable EUV—the bottom line is that the market is looking more skittish. Dan Tracy, SEMI's ... » read more

Front End Comes To The Back End


By Jeff Chappell For outsourced assembly and test (OSAT) houses either planning for or already offering through-silicon via (TSV) capability for their 3D packaging efforts, this has meant the front end is coming to the back end, in a manner of speaking. A bit of an exaggeration perhaps, as most generalizations are. But thanks to TSVs, in a very real sense some of what would typically be the... » read more

Experts at the Table: Stacking the Deck


By Ann Steffora Mutschler System-Level Design sat down to discuss challenges to 3D-IC adoption with Samta Bansal, product marketing for applied silicon realization in strategy and market development at Cadence; Carey Robertson, product marketing director at Mentor Graphics; Karthik Chandrasekar, member of technical staff in IC Design at Altera; and Herb Reiter, president of EDA2ASIC Consulting... » read more

The Changing Role Of The OSAT


By Ann Steffora Mutschler As process geometries and packaging technologies have matured over time, the OSAT (outsourced semiconductor assembly and test) provider has played an evolving role in the semiconductor packaging ecosystem. With true 3D chip stacking on the horizon, their role may evolve once again as ecosystem players jostle for position in the 3D universe. There are two things tha... » read more

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