tag: ARM

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 21 May, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back Combining AI with IoT not only gives another acronym AIoT, or Artificial Intelligence of Things, but it puts AI systems on the edge. Infineon Technologies has released its ModusToolbox Machine Learning to make it possible to run deep learning-based workloads on Infineon’s PSoC microcontrollers. The toolbox has middleware, softwa... » read more

Advanced Packaging’s Next Wave
By Mark LaPedus - 20 May, 2021 - Comments: 0

Packaging houses are readying the next wave of advanced packages, enabling new system-level chip designs for a range of applications. These advanced packages involve a range of technologies, such as 2.5D/3D, chiplets, fan-out and system-in-package (SiP). Each of these, in turn, offers an array of options for assembling and integrating complex dies in an advanced package, providing chip custo... » read more

Blog Review: May 19
By Jesse Allen - 19 May, 2021 - Comments: 0

Cadence's Paul McLellan checks out a project from Intel and DARPA to combine the eASIC structured ASIC technology with data interface chiplets and enhanced security protection, with manufacturing in the U.S. In a podcast, Siemens EDA's Ellie Burns and Michael Fingeroff discuss the gap between what the best AI applications can perform today versus the human brain and the challenges that hardw... » read more

11 Ways To Reduce AI Energy Consumption
By Bryon Moyer - 13 May, 2021 - Comments: 1

As the machine-learning industry evolves, the focus has expanded from merely solving the problem to solving the problem better. “Better” often has meant accuracy or speed, but as data-center energy budgets explode and machine learning moves to the edge, energy consumption has taken its place alongside accuracy and speed as a critical issue. There are a number of approaches to neural netw... » read more

HBM Takes On A Much Bigger Role
By Brian Bailey - 13 May, 2021 - Comments: 1

High-bandwidth memory is getting faster and showing up in more designs, but this stacked DRAM technology may play a much bigger role as a gateway for both chiplet-based SoCs and true 3D designs. HBM increasingly is being viewed as a way of pushing heterogenous distributed processing to a completely different level. Once viewed as an expensive technology that only could be utilized in the hig... » read more

Is AI Good Or Bad For The Planet?
By Dennis Laudick - 13 May, 2021 - Comments: 0

Will artificial intelligence save or sink planet earth? We’re surrounded by AI. When you use the internet, take a photo, use predictive text, or watch TV, you are interacting with AI. And we are still in the early stages of this revolution in technology and our lives. But AI can require large amounts of power. Researchers have documented the astounding amount of power required to train ... » read more

Mapping Heat Across A System
By Ann Mutschler - 13 May, 2021 - Comments: 0

Thermal issues are becoming more difficult to resolve as chip features get smaller and systems get faster and more complex. They now require the integration of technologies from both the design and manufacturing flows, making design for power and heat a much broader problem. This is evident with the evolution of a smart phone. Phones sold 10 years ago were very different devices. Functionali... » read more

Blog Review: May 12
By Jesse Allen - 12 May, 2021 - Comments: 0

Cadence's Claire Ying points to major changes in PCIe 6.0 as PAM4 signaling replaces NRZ to help double bandwidth, Forward Error Correction helps maintain data integrity, and various improvements are made to power consumption. Synopsys' Samantha Beaumont argues that automotive sensors are a major potential attack point and addresses some of the key areas of sensor vulnerability and the chall... » read more

Blog Review: May 5
By Jesse Allen - 05 May, 2021 - Comments: 0

Arm's William Wang considers how to increase the performance and programmability of persistent applications through using battery to protect the on-chip volatile cache hierarchy. Cadence's Paul McLellan finds that ransomware is getting more sophisticated, and more difficult to eradicate and defend against, with potentially life-threatening consequences. Synopsys' Jonathan Knudsen digs int... » read more

Steep Spike For Chip Complexity And Unknowns
By Ed Sperling - 05 May, 2021 - Comments: 0

Cramming more and different kinds of processors and memories onto a die or into a package is causing the number of unknowns and the complexity of those designs to skyrocket. There are good reasons for combining all of these different devices into an SoC or advanced package. They increase functionality and can offer big improvements in performance and power that are no longer available just b... » read more

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