Week In Review: Design, Low Power

By Jesse Allen - 10 Jun, 2022 - Comments: 0

Edge, embedded, IoT Renesas Electronics will acquire Reality Analytics, Inc. (Reality AI), a provider of embedded AI and TinyML solutions for advanced non-visual sensing in automotive, industrial, and commercial products. The inference-based AI solutions can be implemented across various endpoint AI applications. “Customers are increasingly demanding highly customized solutions involving emb... » read more

The Week In Review: IoT

By Jeff Dorsch - 21 Jul, 2017 - Comments: 0

Finance Particle, the provider of a full-stack Internet of Things device platform for enterprises, has raised $20 million in Series B funding, bringing its total venture funding to $30 million. Spark Capital led the new round, with participation by Qualcomm Ventures and existing investors in the IoT startup. Machina Research estimates cellular IoT connections will increase from 334 million in ... » read more

The Week In Review: IoT

By Jeff Dorsch - 09 Dec, 2016 - Comments: 0

Analysis Some consumer IoT products are actually useful and helpful in daily life, such as the Nest Learning Thermostat and the Honeywell Lyric for home automation, David Pogue writes. Then there are the products that make most people scratch their heads – IoT water bottles, the IoT toilet-paper dispenser, the IoT toothbrush, IoT umbrella, IoT fork, the IoT egg tray, and so on, he notes. “... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Bluetooth SIG

Week In Review: Design, Low Power

The Week In Review: IoT

The Week In Review: IoT